Senior Packaging Failure Analysis Lead - MEMS & Photonics

nEye.ai; Santa Clara (CA); On-site; USD 165,000 - 215,000; Full time

Job summary

nEye.ai is hiring a hands-on Senior Packaging Failure Analysis Engineer to lead root-cause investigations for silicon photonics, MEMS, and optical packaging. You will own analysis from non-destructive to destructive stages, selecting the right methods and delivering actionable recommendations to design and manufacturing teams.

The role emphasizes cross-sectioning, interfacial analysis, and building in-house FA capabilities, with a focus on bonded interfaces and solder/joint reliability.

Qualifications

• 8+ years of hands-on failure analysis in semiconductors/packaging.
• Strong cross-sectioning and analysis of bonded interfaces.
• Proficiency with SEM/EDS, FIB, XPS, XRD, and microscopy.
• Ability to translate analytical results into engineering actions.

Responsibilities

• Lead structured failure analysis and root-cause investigations across photonics, MEMS, packaging, and PCBA.
• Perform cross-sections of bonded structures and assess defects and interfacial issues.
• Develop FA workflows using non-destructive and destructive techniques.
• Interpret results to drive design, process, and supplier improvements.
• Build and maintain an in-house FA capability and documentation.

Skills

Materials science expertise

Failure analysis

Root-cause problem-solving

Cross-sectioning

Analytical reasoning

Education

BS/MS/PhD in Materials Science/Physics/Engineering

Tools

SEM/EDS

FIB

XPS

XRD

Optical microscopy

X-ray/CT

SAM

FTIR

DSC

Job description

nEye.ai is hiring a hands-on Senior Packaging Failure Analysis Engineer to lead root-cause investigations for silicon photonics, MEMS, and optical packaging. You will own analysis from non-destructive to destructive stages, selecting the right methods and delivering actionable recommendations to design and manufacturing teams.

The role emphasizes cross-sectioning, interfacial analysis, and building in-house FA capabilities, with a focus on bonded interfaces and solder/joint reliability.