Senior Packaging Failure Analysis Engineer (MEMS/Photonics)

nEye Systems, Inc.; Santa Clara (CA); Hybrid; USD 165,000 - 220,000; Full time

Job summary

nEye.ai seeks a hands-on Senior Packaging Failure Analysis Engineer to lead root-cause investigations across silicon photonics, MEMS, optical packaging, and bonded assemblies. You will own analyses from non-destructive to destructive stages, select the right characterization methods, and translate findings into corrective actions.

The role emphasizes interfacial phenomena, cross-sectioning, and mastering SEM/EDS, FIB, XPS, XRD, and related techniques while enabling in-house FA capabilities and

Qualifications

• BS/MS/PhD in Materials Science, Materials Engineering, Physics, Mechanical Engineering or related field.

Responsibilities

• Lead structured failure analysis and root-cause investigations across silicon photonics, MEMS, optical packaging, bonded assemblies, and PCBAs.
• Perform and interpret cross-sections of bonded structures and material interfaces, identifying defects, intermetallic formation, diffusion, cracking, voiding, contamination, delamination, and other failure mechanisms.
• Develop FA workflows using non-destructive and destructive analytical techniques (optical microscopy, X-ray/CT, SEM/EDS, XPS, XRD, FTIR, DSC, etc.).
• Translate analytical results into actionable root-cause and corrective actions; feed learnings back into design, manufacturing, and supplier processes.
• Build in-house FA capabilities: cross-sectioning/polishing, microscopy, SEM/EDS, and related infrastructure.
• Maintain FA documentation and drive 8D/root-cause and corrective-action closure.
• Support product qualification and reliability investigations against JEDEC, Telcordia GR-468, MIL-STD-883.

Skills

Materials science

Failure analysis

Cross-sectioning

Interfacial phenomena

Semiconductors

Silicon photonics

Analytical characterization

Microscopy

Root-cause problem solving

Education

Bachelor/Master/PhD in Materials Science or related

Tools

SEM/EDS

FIB

XPS

XRD

Optical microscopy

X-ray CT

SAM

FTIR

DSC

Job description

nEye.ai seeks a hands-on Senior Packaging Failure Analysis Engineer to lead root-cause investigations across silicon photonics, MEMS, optical packaging, and bonded assemblies. You will own analyses from non-destructive to destructive stages, select the right characterization methods, and translate findings into corrective actions.

The role emphasizes interfacial phenomena, cross-sectioning, and mastering SEM/EDS, FIB, XPS, XRD, and related techniques while enabling in-house FA capabilities and