Senior Silicon Photonics Designer & Failure Analysis

Socket.dev

Santa Clara (CA)

On-site

USD 140,000 - 190,000

Full time

8 days ago

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Job summary

nEye.ai is seeking a hands-on Senior Packaging Failure Analysis Engineer to lead root-cause investigations across silicon photonics, MEMS, optical packaging, and electronic assemblies in Santa Clara, CA. You will specialize in cross-sectioning bonded components and interfacial analysis.

From non-destructive screening through destructive physical analysis, you will select characterization methods, translate results into corrective actions, and feed learnings back to design, manufacturing, and

Qualifications

PhD or equivalent with strong research background in photonics or packaging.
Experience in failure analysis of silicon photonics, MEMS, and optical packaging.
Proven ability to translate complex findings into actionable design/cprocess improvements.
Hands-on experience with SEM/EDS and related analytical workflows.

Responsibilities

Lead root-cause investigations across silicon photonics and packaging.
Perform cross-sectioning and interfacial analysis of bonded components.
Define suitable characterization techniques for each problem and drive analyses.
Communicate findings clearly to design, manufacturing, and supplier teams.
Help build and expand in-house failure analysis capabilities.