Senior Silicon Photonics Designer & Failure Analysis Lead

nEye Systems, Inc.; Santa Clara, Northern (CA, KY); Hybrid; USD 135,000 - 180,000; Full time

Job summary

nEye.ai is seeking a hands-on Senior Packaging Failure Analysis Engineer to lead root-cause investigations across silicon photonics, MEMS, optical packaging, and electronic assemblies.

This role focuses on cross-sectioning bonded components, analyzing material interfaces, and applying characterization techniques to translate findings into corrective actions. Over time, you may help grow in-house failure analysis capabilities with SEM/EDS and related infrastructure.

Qualifications

• PhD degree in Electrical Engineering, Materials Science, Applied Physics, Chemistry, or a related technical discipline.
• 1-4 years of hands-on experience with Si Photonics.
• Strong understanding of microfabrication processes and related constraints on photonic component designs.
• Strong understanding and proficient experience of photonic component simulation tools such as FDTD, EME, FEM, or FIT.
• Strong proficiency in Python.
• Experience with photonic integrated circuit layout and photonics foundry tape-out.
• Experience with designing and executing detailed photonic device experiments and characterization protocols.
• Strong communication skills in collaboration, verbal presentation, and written reports.
• Excellent interpersonal, communication (written and oral), and leadership skills.

Responsibilities

• Collaborating with other groups to optimize chip design for product system-level requirements.
• Driving specific device designs and collaborating on fabrication methodologies.
• Designing photonic components and photonic integrated circuits to advance our optical switch technology.
• Developing, overseeing, and performing photonic component and system-level testing.
• Working cross-functionally with system and fabrication team members to develop improved optical switch capabilities.

Skills

Python proficiency

Photonic device experiments

Communication skills

Leadership skills

Education

PhD degree in Electrical Engineering, Materials Science, Applied Physics, Chemistry, or a related technical discipline

Tools

FDTD

EME

FEM

FIT

Job description

nEye.ai is seeking a hands-on Senior Packaging Failure Analysis Engineer to lead root-cause investigations across silicon photonics, MEMS, optical packaging, and electronic assemblies.

This role focuses on cross-sectioning bonded components, analyzing material interfaces, and applying characterization techniques to translate findings into corrective actions. Over time, you may help grow in-house failure analysis capabilities with SEM/EDS and related infrastructure.