Sr. Packaging Engineer

Skyworks Solutions, Inc; Irvine (CA); On-site; USD 91,000 - 177,000; Full time

Benefits offered by this job

Healthcare benefits

401(k) plan

Employee stock purchase plan

Paid time off

Job summary

Skyworks Solutions, Inc. is seeking a Sr. Packaging Engineer in Irvine, CA to lead IC packaging process development with internal teams and external suppliers. You will manage project plans, drive reliability testing, and push cost-reduction opportunities while addressing quality issues.

The role requires a bachelor's in a related engineering field and 5+ years in semiconductor packaging, with strong communication and problem-solving abilities. Travel may be required.

Qualifications

• Bachelor's degree in a relevant engineering field is required.
• Minimum 5 years of semiconductor packaging experience.
• Strong knowledge of failure analysis, materials interaction and yield improvement.
• Familiarity with SPC, FMEAs, Six Sigma and reliability standards.
• Excellent communication and problem solving skills.

Responsibilities

• Create project plans with timeline, cost, risk assessments and mitigations.
• Execute NTI release to production through characterization and reliability testing.
• Drive process development, design rule improvements, and material development.
• Manage multiple activities with defined scope and schedules.
• Travel domestically and internationally as needed.

Education

Bachelor's Degree in Materials/Mechanical/Electrical Engineering

Tools

Cadence Allegro

AutoCAD

Job description

Job Description

If you are looking for a challenging and exciting career in the world of technology, then look no further. Skyworks is an innovator of high-performance analog semiconductors whose solutions are powering the wireless networking revolution.Through our broad technology expertise and one of the most extensive product portfolios in the industry, we are Connecting Everyone and Everything, All the Time.

At Skyworks, you will find a fast-paced environment with a strong focus on global collaboration, minimal layers of management, and the freedom to make meaningful contributions in a setting that encourages creative thinking. We are excited about the opportunity to work with you and glad you want to be part of a team of talented individuals who together are changing the way the world communicates.

Requisition ID:77803

Job Title

Sr. Packaging Engineer

Posting Start Date

7/27/26

Job Location(s)

Irvine

Job Description

In this role, candidate will manage and execute IC Packaging Process development, working with internal design, manufacturing & reliability teams and external material & equipment suppliers.

Location is Irvine, CA.

Responsibilities

• Candidate will be responsible for creation of project plans including timeline, cost, risk assessments and mitigation plan.
• Candidate will execute NTI release to production through characterization, DOE, reliability testing, qualification, & high volume validation.
• Typical projects focus on process development, design rule improvement, material development, drive cost reduction opportunities and solving RMA / quality issues.
• Candidate will rely upon program management skills to keep multiple activities with scope and schedule of the overall program objectives.
• Domestic and international travel may be needed.

Required Experience and Skills

• Minimum a Bachelor's Degree qualification in Material Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering and other related specialization.
• Position requires minimum 5 years job experience.
• Relevant technical experience in semiconductor packaging technology.
• Technical expertise required in failure analysis, material interaction, and yield improvement.
• Good understanding of SPC, FMEAs, Six Sigma, and Reliability Standards.
• Candidate is expected to possess excellent communication skills, verbal, written, and presentation.
• Good problem solving skill.
• Self-motivated individual who is assertive and results/goal oriented.
• Team player with good interpersonal skills and able to work efficiently with multi-functional and multi-cultural groups.

Desired Experience and Skills

• R&D experience in advanced SiP packaging development.
• Hands-on experience in packaging design rule define and process & material development: SMT, Flip Chip, Mold, & Singulation.
• Knowledge of Flip Chip Bumping, WLCSP, Fan Out, Stack integration, Dual Side BGA/MGA.
• Experience in Cadence Allegro and AutoCAD design tool.

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The typical base pay range for this role across the U.S. is currently USD$91,200 -$177,200 per year. Starting base pay will depend on relevant experience and skills, training and education, business needs, market demands, the ultimate job duties and requirements, and work location. Skyworks has different base pay ranges for different work locations in the U.S. Benefits include access to healthcare benefits (including a premium-free medical plan option), a 401(k) plan and company match, an employee stock purchase plan, paid time off (including vacation, sick/wellness, parental leave), among others. Employees are eligible to participate in an incentive plan, and certain roles are also eligible for additional awards, including recognition and stock. These incentives and awards are based on individual and/or company performance.

Skyworks is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, age, sex, sexual orientation, gender identity, national origin, disability, protected veteran status, or any other characteristic protected by law.Skyworks strives to create an accessible workplace; if you need an accommodation due to a disability, please contact us at [e-mail].