Package Process Development - Sr. Manager, Engineering

Skyworks Solutions, Inc; Irvine (CA); On-site; USD 143,000 - 286,000; Full time

Benefits offered by this job

Healthcare benefits

401(k) plan

Employee stock purchase plan

Paid time off

Job summary

Skyworks Solutions, Inc in Irvine seeks a seasoned Package Process Development Sr. Manager, Engineering to lead NTI activities and advance RF SiP packaging technologies.

You will drive process roadmaps, partner with OSATs and internal teams, and ensure smooth transitions from development to mass production. The role requires a strong technical background in RF SiP packaging, extensive leadership experience, and a track record of implementing advanced packaging solutions across manufacturing

Qualifications

• MS or PhD in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or related field.
• 12+ years semiconductor packaging with 3+ years in leadership/management.
• Strong hands-on RF SiP package development and assembly process engineering.

Responsibilities

• Lead NTI activities for advanced RF SiP packaging platforms.
• Develop process roadmaps and technology strategies for future RF module needs.
• Evaluate and introduce innovative assembly, interconnect, molding, substrate, shielding, and packaging technologies.
• Drive DFM, DFA, DFR during product development and ensure production readiness.
• Partner with cross-functional teams to transition development into production.
• Own development and optimization of RF SiP assembly processes (Die Attach, Flip Chip, Wire Bonding, WLP, Encapsulation).
• Define process windows, critical parameters, and control methodologies.
• Lead DOE, process characterization, RCA, and yield improvements.
• Establish process specs, qualification plans, and manufacturing standards.
• Drive pilot builds, engineering builds, qualification, and ramp readiness.
• Develop process control plans and monitor manufacturing performance.
• Collaborate with OSATs, vendors, and partners for scalable production solutions.

Skills

RF SiP packaging

Technical leadership

DFM/ DFA/ DFR

DOE / SPC / FMEA

Cross-functional collaboration

Education

MS or PhD in Electrical/Materials/Mechanical Eng

Tools

OSAT collaboration

Job description

Package Process Development - Sr. Manager, Engineering

Irvine

If you are looking for a challenging and exciting career in the world of technology, then look no further. Skyworks is an innovator of high-performance analog semiconductors whose solutions are powering the wireless networking revolution. Through our broad technology expertise and one of the most extensive product portfolios in the industry, we are Connecting Everyone and Everything, All the Time.

At Skyworks, you will find a fast-paced environment with a strong focus on global collaboration, minimal layers of management, and the freedom to make meaningful contributions in a setting that encourages creative thinking. We are excited about the opportunity to work with you and glad you want to be part of a team of talented individuals who together are changing the way the world communicates.

Key Responsibilities

Technology Development & NTI

• Lead New Technology Introduction (NTI) activities for advanced RF SiP packaging platforms.
• Develop process roadmaps and technology strategies to support future RF module and SiP product requirements.
• Evaluate and introduce innovative assembly, interconnect, molding, substrate, shielding, and packaging technologies.
• Drive Design for Manufacturability (DFM), Design for Assembly (DFA), and Design for Reliability (DFR) initiatives during product development.
• Partner with cross-functional teams to ensure seamless transition from technology development into production.

Package Process Development

• Own development and optimization of RF SiP assembly processes, including:
  • Die Attach
  • Flip Chip Assembly
  • Wire Bonding
  • Wafer-Level Packaging Integration
  • Underfill
  • Encapsulation/Molding
  • Shielding Processes
  • SMT and Board-Level Assembly
• Define process windows, critical process parameters, and control methodologies.
• Lead DOE (Design of Experiments), process characterization, root cause analysis, and yield improvement initiatives.
• Establish process specifications, qualification plans, and manufacturing standards.

Manufacturing Readiness & Production Transfer

• Drive process development activities from concept through production release.
• Lead pilot builds, engineering builds, process qualification, and production ramp readiness assessments.
• Develop process control plans and monitoring strategies to ensure consistent manufacturing performance.
• Work closely with OSATs, subcontractors, equipment vendors, and manufacturing partners to implement scalable production solutions.
• Support factory transfer and production ramp-up activities.

Reliability & Quality

• Partner with reliability and quality engineering teams to ensure package/process robustness.
• Define package qualification requirements and reliability stress test plans.
• Lead failure analysis investigations and corrective action implementation.
• Ensure compliance with customer, industry, and regulatory reliability requirements.

Leadership & Team Development

• Build and lead a high-performing package process development team.
• Provide technical mentorship and career development for engineers.
• Foster a culture of innovation, accountability, and continuous improvement.
• Coordinate activities across global engineering, manufacturing, and supplier organizations.

Required Qualifications

• MS or PhD in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or related field.
• 12+ years of semiconductor packaging experience with at least 3 years in a technical leadership or management role.
• Strong hands‑on experience in RF SiP package development and assembly process engineering.
• Proven track record of successfully launching new package technologies into mass production.
• Deep understanding of semiconductor package assembly processes and equipment.
• Experience with NTI programs and technology transfer to manufacturing.
• Strong knowledge of statistical process control, DOE, FMEA, SPC, and process qualification methodologies.
• Experience working with OSATs and external manufacturing partners.
• Excellent problem-solving, communication, and cross‑functional leadership skills.

Desired Experience and Skills

• Extensive experience with RF front‑end modules, wireless communication products, or advanced SiP technologies.
• Knowledge of RF performance impacts associated with package structures and assembly processes.
• Experience with advanced packaging technologies such as:
  • Fan‑Out Packaging
  • Wafer‑Level Packaging (WLP)
  • Panel‑Level Packaging (PLP)
  • Heterogeneous Integration
  • Multi‑Chip Modules (MCM)
  • Embedded Component Technologies
• Strong understanding of package reliability physics and failure mechanisms.
• Experience supporting automotive, mobile, Wi‑Fi, Bluetooth, GNSS, or cellular RF products.

#LI-JR1

The typical base pay range for this role across the U.S. is currently USD$143,000 -$286,400 per year. Starting base pay will depend on relevant experience and skills, training and education, business needs, market demands, the ultimate job duties and requirements, and work location. Skyworks has different base pay ranges for different work locations in the U.S. Benefits include access to healthcare benefits (including a premium‑free medical plan option), a 401(k) plan and company match, an employee stock purchase plan, paid time off (including vacation, sick/wellness, parental leave), among others. Employees are eligible to participate in an incentive plan, and certain roles are also eligible for additional awards, including recognition and stock. These incentives and awards are based on individual and/or company performance.

Skyworks is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, age, sex, sexual orientation, gender identity, national origin, disability, protected veteran status, or any other characteristic protected by law. Skyworks strives to create an accessible workplace; if you need an accommodation due to a disability, please contact us at [e-mail].