Package Engineer, Annapurna Labs - AI Silicon Packaging

Amazon; Austin (TX); On-site; USD 120,000 - 180,000; Full time

Job summary

Annapurna Labs, an Amazon subsidiary, is seeking an engineer to lead packaging technology development for Trainium systems. You will define architecture, materials, and processes from concept through volume production, collaborating across silicon, board, and system teams.

The role requires partnering with OSATs and suppliers for validation, qualification, risk analysis, and root-cause investigations to ensure cost-effective, reliable packaging solutions.

Responsibilities

• Define and drive package technology development across architecture, design, materials, processes, yield, warpage, reliability, and system-level integration for next-generation Trainium systems, from early concept through volume production.
• Partner with OSATs and component/material/equipment suppliers on capability validation, test vehicle development, qualification, TGA, FMEA, risk retirement, root-cause analysis, and corrective/preventive actions
• Evaluate tradeoffs across performance, cost, yield, manufacturability, warpage, thermal performance, and reliability to guide technology decisions and qualification strategies.
• Represent the package technology team in cross-functional design reviews, sign-off milestones, and program checkpoints with silicon, board, system, and supply chain teams.
• Identify opportunities for novel packaging architectures and process simplifications to reduce cost, improve yield, and accelerate time-to-market.

Job description

Annapurna Labs designs silicon and software that accelerates innovation. Customers choose us to create cloud solutions that solve challenges that were unimaginable a short time ago. Our custom chips, accelerators, and software stacks enable us to take on technical challenges that have never been seen before, and deliver results that help our customers change the world.

The Package Technology Development team within Annapurna Labs is building the packaging, substrate/PCB, interposer, and assembly technologies for the next-generation Trainium AI accelerators. The team works at the intersection of silicon, package, board, system, and rack, partnering closely with design, manufacturing, supply chain, and reliability teams to bring bleeding-edge AI systems from concept to volume production.

Key job responsibilities

• Define and drive package technology development across architecture, design, materials, processes, yield, warpage, reliability, and system-level integration for next-generation Trainium systems, from early concept through volume production.
• Partner with OSATs and component/material/equipment suppliers on capability validation, test vehicle development, qualification, TGA, FMEA, risk retirement, root-cause analysis, and corrective/preventive actions
• Evaluate tradeoffs across performance, cost, yield, manufacturability, warpage, thermal performance, and reliability to guide technology decisions and qualification strategies.
• Represent the package technology team in cross-functional design reviews, sign-off milestones, and program checkpoints with silicon, board, system, and supply chain teams.
• Identify opportunities for novel packaging architectures and process simplifications to reduce cost, improve yield, and accelerate time-to-market.