Package Tech Engineer — Next-Gen AI Accelerators

Amazon Inc.; Tempe (AZ); On-site; USD 154,000 - 215,000; Full time

Benefits offered by this job

Health insurance

401(k) matching

Paid time off

Parental leave

Job summary

Annapurna Labs, a division of Amazon, is seeking a senior packaging technology development engineer to shape next-generation Trainium systems. You will work at the intersection of silicon, package, board, system, and rack, partnering with design, manufacturing, supply chain, and reliability teams.

You will define technology development, drive qualification, and optimize cost, yield, and time-to-market while collaborating with OSATs and suppliers.

Qualifications

• Experience coordinating between technical teams, peers and business stakeholders.
• Track record of driving technology development from concept through qualification.
• Expertise in package, interposer, or board assembly technology.

Responsibilities

• Define and drive package technology development across architecture, design, materials, processes, yield, warpage, reliability, and system-level integration for next-generation Trainium systems, from concept through volume production.
• Partner with OSATs and suppliers on validation, test vehicle development, qualification, risk retirement, root-cause analysis, and corrective actions.
• Evaluate tradeoffs across performance, cost, yield, manufacturability, warpage, thermal performance, and reliability to guide technology decisions.
• Represent the package technology team in cross-functional reviews, milestones, and program checkpoints with silicon, board, system, and supply chain teams.
• Identify opportunities for novel packaging architectures and process simplifications to reduce cost and accelerate time-to-market.

Skills

Project coordination

Cross-functional collaboration

Technology development

Reliability and qualification

Education

Bachelor's in Materials Science, Mechanical Engineering, Electrical Engineering, or Chemical Engineering; or 6+ years related experience

Job description

Annapurna Labs, a division of Amazon, is seeking a senior packaging technology development engineer to shape next-generation Trainium systems. You will work at the intersection of silicon, package, board, system, and rack, partnering with design, manufacturing, supply chain, and reliability teams.

You will define technology development, drive qualification, and optimize cost, yield, and time-to-market while collaborating with OSATs and suppliers.