Sr. Package Engineer, Annapurna Labs - AI Silicon Packaging

Amazon; Austin (TX); On-site; USD 185,000 - 250,000; Full time

Benefits offered by this job

Health insurance

401(k) matching

Paid time off

RSUs

Job summary

Annapurna Labs, part of Amazon, is building advanced Trainium packaging technologies at Tempe and Austin. You will drive cross‑functional development across architecture, materials, and assembly to enable scalable production of next‑gen AI accelerators.

You will partner with OSATs and suppliers, balance performance and cost, and guide design reviews with silicon, board and supply chain teams. A strong background in packaging technology is essential.

Qualifications

• Bachelor's degree in Materials Science, mechanical, electrical or chemical engineering or 10+ years of industry experience in a related field.
• Expertise in substrate/PCB, interposer, or package and board assembly technology.
• Experience coordinating between technical teams, peers and business stakeholders.
• Track record driving technology development from concept through qualification.

Responsibilities

• Define and drive package technology development across architecture, design, materials, processes, yield, warpage, reliability, and system-level integration.
• Partner with OSATs and suppliers on validation, test vehicle development, qualification, FMEA, root-cause analysis and corrective actions.
• Evaluate tradeoffs across performance, cost, yield, manufacturability, warpage, thermal performance and reliability.
• Represent the team in cross-functional design reviews and program checkpoints with silicon, board, system, and supply chain teams.
• Identify opportunities for novel packaging architectures and process simplifications to reduce cost and accelerate time-to-market.

Skills

Cross-functional coordination

Package technology

System-level integration

Vendor and supplier collaboration

Education

Bachelor's in Materials Science or Mechanical/Electrical/Chemical Engineering

10+ years of industry experience in a related field

Tools

Substrate/PCB technology

Interposer technology

Package and board assembly technology

DFM for advanced packaging (HDI, microvias)

Job description

Annapurna Labs designs silicon and software that accelerates innovation. Customers choose us to create cloud solutions that solve challenges that were unimaginable a short time ago. Our custom chips, accelerators, and software stacks enable us to take on technical challenges that have never been seen before, and deliver results that help our customers change the world.
The Package Technology Development team within Annapurna Labs is building the packaging, substrate/PCB, interposer, and assembly technologies for the next-generation Trainium AI accelerators. The team works at the intersection of silicon, package, board, system, and rack, partnering closely with design, manufacturing, supply chain, and reliability teams to bring bleeding-edge AI systems from concept to volume production.

Key job responsibilities

• Define and drive package technology development across architecture, design, materials, processes, yield, warpage, reliability, and system-level integration for next-generation Trainium systems, from early concept through volume production.
• Partner with OSATs and component/material/equipment suppliers on capability validation, test vehicle development, qualification, TGA, FMEA, risk retirement, root-cause analysis, and corrective/preventive actions
• Evaluate tradeoffs across performance, cost, yield, manufacturability, warpage, thermal performance, and reliability to guide technology decisions and qualification strategies.
• Represent the package technology team in cross-functional design reviews, sign-off milestones, and program checkpoints with silicon, board, system, and supply chain teams.
• Identify opportunities for novel packaging architectures and process simplifications to reduce cost, improve yield, and accelerate time-to-market.

Basic Qualifications

• Experience coordinating between technical teams, peers and business stakeholders
• Bachelor's in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, or 10+ years of industry experience in a related field
• Expertise in at least one: substrate/PCB technology, interposer technology, or package and board assembly technology
• Track record of driving technology development from concept through qualification

Preferred Qualifications

• Master's in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, or 8+ years of industry experience in a related field
• Or PhD in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, or 6+ years of industry experience in a related field
• Familiarity with package-level SI/PI concepts (impedance control, PDN design, crosstalk-aware routing) sufficient to collaborate with SI/PI engineers
• Experience with substrate/PCB architecture, materials, processes, yield, warpage, and DFM for advanced systems, including HDI, microvias, fine-line/space, and high-speed/power routing
• Experience with interposer fabrication and DFM for 2.5D/3D systems (e.g., CoWoS-R/L), including RDL, TSV, silicon bridges, microbumps, and package floorplanning
• Experience with package and board assembly processes, including flip-chip, thermal compression bonding, hybrid bonding, underfill, molding, TIM, and fine-pitch assembly. Co-packaged optics (CPO) experience is a plus.

Amazon is an equal opportunity employer and does not discriminate on the basis of protected veteran status, disability, or other legally protected status.

Our inclusive culture empowers Amazonians to deliver the best results for our customers. If you have a disability and need a workplace accommodation or adjustment during the application and hiring process, including support for the interview or onboarding process, please visit https://amazon.jobs/content/en/how-we-hire/accommodations for more information. If the country/region you’re applying in isn’t listed, please contact your Recruiting Partner.

The base salary range for this position is listed below. Your Amazon package will include sign-on payments and restricted stock units (RSUs). Final compensation will be determined based on factors including experience, qualifications, and location. Amazon also offers comprehensive benefits including health insurance (medical, dental, vision, prescription, Basic Life & AD&D insurance and option for Supplemental life plans, EAP, Mental Health Support, Medical Advice Line, Flexible Spending Accounts, Adoption and Surrogacy Reimbursement coverage), 401(k) matching, paid time off, and parental leave. Learn more about our benefits at https://amazon.jobs/en/benefits.

USA, AZ, Tempe - 185,200.00 - 250,000.00 USD annually
USA, TX, Austin - 185,200.00 - 250,000.00 USD annually

Amazon is an equal opportunity employer and does not discriminate on the basis of protected veteran status, disability, or other legally protected status. Veterans, military spouses, and people with disabilities are encouraged to apply.