Senior Packaging Architect — 3D Photonics for AI HPC (Hybrid)

Lightmatter; Mountain View (CA); Hybrid; USD 218,000 - 317,000; Full time

Benefits offered by this job

Health Care Plan (Medical, Dental &amp

Retirement Savings Matching

Equity grants

Hybrid workplace model

Job summary

Lightmatter is transforming AI data center infrastructure with a focus on advanced packaging. As a Packaging Architect, you will own packaging solutions from concept to release, collaborating with chip designers, system architects, and cross-functional teams to balance performance, cost, and manufacturability across the full product lifecycle.

You will define electrical, thermal, and mechanical specs, drive architecture trade-offs, and ensure alignment with project budgets and schedules, while

Qualifications

• PhD or Master’s degree in Electrical/Mechanical/Materials or related field.
• 15+ years in advanced (2D/3D) packaging techs with optical packaging exposure.
• 10+ years in power/signal integrity, thermal-mechanical analysis, or optical packaging.
• Ability to perform system-level trade-offs across silicon, package, and board.
• Extensive experience with high-speed interfaces (SERDES, PCIe, D2D).
• Proven track record delivering packaging from concept to production.

Responsibilities

• Evaluate trade-offs across layouts, die-to-die interfaces, fiber attachment, and packaging techs.
• Define packaging specifications spanning electrical, thermal, and mechanical performance.
• Determine optimal package architecture through design constraint analysis.
• Partner with supply chain engineering for substrate fabrication and materials.
• Collaborate with Q&R on packaging requirements and qualification criteria.
• Engage with product teams and customers to anticipate future packaging architectures.
• Monitor the competitive landscape to inform strategic decisions.

Skills

Packaging architecture

Trade-off analysis

High-speed interfaces

EDA/CAD tools

Education

PhD or Master’s in EE/Mech/Materials

Tools

EDA tools

CAD tools

Job description

Lightmatter is transforming AI data center infrastructure with a focus on advanced packaging. As a Packaging Architect, you will own packaging solutions from concept to release, collaborating with chip designers, system architects, and cross-functional teams to balance performance, cost, and manufacturability across the full product lifecycle.

You will define electrical, thermal, and mechanical specs, drive architecture trade-offs, and ensure alignment with project budgets and schedules, while