Lead 3D Packaging & Assembly Engineer (Hybrid)

Lightmatter; Mountain View (CA); Hybrid; USD 218,000 - 317,000; Full time

Benefits offered by this job

Health Care Plan

Retirement matching

Life Insurance

Generous Time Off

Paid Family Leave

Disability

Training & Development

Commuter Benefits

Hybrid workplace

Equity grants

Job summary

Lightmatter is hiring a Lead Package Assembly Integrator in Mountain View, CA. You will drive end-to-end 3D package assembly, test, and fiber-attach processes, working with design teams, silicon and photonics foundries, and OSAT partners to ensure manufacturability and reliability.

This role focuses on designing high-yield assembly rules and DOE planning to deliver cutting-edge data-center solutions. You will lead test chip strategies, manage test chip design, and coordinate with package and

Qualifications

• MS or PhD in Mechanical Engineering, Materials Science, or related field.
• Experience in wafer scale packaging assembly process development.
• Understanding of 2D/3D packaging technologies, materials, and equipment requirements.

Responsibilities

• Develop end-to-end 3D package assembly, test, and fiber-attach processes for Lightmatter products.
• Develop and execute package architectures and designs for manufacturability and reliability.
• Define test chip requirements and manage test chip design for 3D package process development.
• Develop and validate design rules for high-yield assembly processes across multiple domains.
• Plan and execute DOE with partners; manage data and analyses.

Skills

Communication skills

Project ownership

Creative problem solving

Thermal modeling

Education

MS/PhD in Mechanical Engineering

Job description

Lightmatter is hiring a Lead Package Assembly Integrator in Mountain View, CA. You will drive end-to-end 3D package assembly, test, and fiber-attach processes, working with design teams, silicon and photonics foundries, and OSAT partners to ensure manufacturability and reliability.

This role focuses on designing high-yield assembly rules and DOE planning to deliver cutting-edge data-center solutions. You will lead test chip strategies, manage test chip design, and coordinate with package and