Senior Packaging Architect — Photonics for AI HPC

Socket.dev; Mountain View (CA); Hybrid; USD 218,000 - 317,000; Full time

Benefits offered by this job

Health care

Retirement match

Life insurance

Paid time off

Family leave

Disability coverage

Training & development

Commuter benefits

Hybrid schedule

Equity grants

Job summary

Lightmatter is seeking a Packaging Architect to lead advanced packaging solutions from concept to production, partnering with cross-functional teams across substrate, signal integrity, and power integrity. Translate complex requirements into precise packaging specs balancing performance, cost, and manufacturability.

You will drive architecture trade-offs, align stakeholders, and ensure packaging meets engineering and business objectives throughout the product lifecycle.

Qualifications

• Ph.D. or Master’s degree in Electrical, Mechanical, Materials Science, or related field.

Responsibilities

• Evaluate and trade off packaging options across silicon, package, and system levels.
• Define packaging specs for electrical, thermal, and mechanical performance.
• Collaborate with supply chain and QA to ensure manufacturability and reliability.
• Engage with product teams and customers to influence roadmap in data center and HPC segments.

Skills

Packaging expertise

Optical packaging

Power integrity

Signal integrity

Thermal analysis

D2D interconnects

SERDES/PCIe

EDA tools

CAD tools

Education

Ph.D. or Master’s in EE/ME/Materials

Tools

EDA tools

CAD tools

Job description

Lightmatter is seeking a Packaging Architect to lead advanced packaging solutions from concept to production, partnering with cross-functional teams across substrate, signal integrity, and power integrity. Translate complex requirements into precise packaging specs balancing performance, cost, and manufacturability.

You will drive architecture trade-offs, align stakeholders, and ensure packaging meets engineering and business objectives throughout the product lifecycle.