Senior IC Package Layout Engineer – 3D/Photonic Packaging

Lightmatter; Mountain View (CA); Hybrid; USD 157,000 - 176,000; Full time

Benefits offered by this job

Retirement Savings Matching Program

Life Insurance (Basic, Voluntary & AD&

Generous Time Off (Vacation, Sick &amp

Paid Family Leave

Short Term & Long Term Disability

Training & Development

Flexible, hybrid workplace model

Equity grants (applicable to full-time

Job summary

Lightmatter is seeking a Package Layout Design Engineer to drive the next generation products from concept to development.

You will be part of the Signal Integrity, Power Integrity and Packaging team, delivering substrate layouts that support the package architecture from concept, through design optimization and completion, meeting stringent signal integrity, power integrity, and design for manufacturing requirements.

Qualifications

• B.S. or M.S. in Electrical Engineering or similar with 5+ years in IC package layout.
• Minimum 3–5 years of IC package layout experience.
• Strong understanding of IC package substrates and materials impact.
• Proficiency with layout tools and design rules.

Responsibilities

• Deliver IC package substrate layouts for standard and advanced packaging technologies.
• Support floorplanning and initial designs to optimize silicon/package/stack-up.
• Collaborate with substrate suppliers and OSATs on design rules and assembly guidelines.
• Generate fab files and coordinate for DFM/ DFA closures.
• Design layouts meeting SI, PI, thermal and mechanical requirements.
• Support design automation and verification to improve throughput.
• Coordinate cross-functional teams for tape-out on schedule.

Skills

Excellent communication

Cross-functional collaboration

Problem solving

Attention to detail

Education

B.S. or M.S. in Electrical Engineering

Tools

Allegro X APD

Cadence Integrity 3DIC

Expedition Package Designer

Pads Layout

Altium

Python

Job description

Lightmatter is seeking a Package Layout Design Engineer to drive the next generation products from concept to development.

You will be part of the Signal Integrity, Power Integrity and Packaging team, delivering substrate layouts that support the package architecture from concept, through design optimization and completion, meeting stringent signal integrity, power integrity, and design for manufacturing requirements.