Packaging Design Integration Engineer – New Grad

Global Foundries; Essex Junction (VT); On-site; USD 85,000 - 146,000; Full time

Job summary

GlobalFoundries is seeking a highly motivated New College Graduate to join the Advanced Packaging and Silicon Photonics team as a Packaging Design Integration Engineer. You will collaborate with experienced engineers and cross-functional teams to support chip package co-design activities for electro-optical transceivers using GF's Photonix platform and advanced 2.5D/3D packaging technologies.

You will contribute to thermal, mechanical, electrical, and optical design integration activities,

Qualifications

• Strong analytical and problem-solving skills.
• Academic exposure to semiconductor packaging, silicon photonics, or related fields.
• Proven ability to work in cross-functional teams and communicate effectively.

Responsibilities

• Support packaging design integration for silicon photonics and advanced packaging products.
• Assist with thermal, mechanical, electrical, and optical co-design analyses under guidance.
• Contribute to design rule development and manufacturability assessments.

Skills

Analytical thinking

Problem solving

Communication

Teamwork

Cross-functional

Education

Bachelors/Masters/PhD in STEM

Tools

HFSS

Zemax

FloTHERM

FEA

Job description

GlobalFoundries is seeking a highly motivated New College Graduate to join the Advanced Packaging and Silicon Photonics team as a Packaging Design Integration Engineer. You will collaborate with experienced engineers and cross-functional teams to support chip package co-design activities for electro-optical transceivers using GF's Photonix platform and advanced 2.5D/3D packaging technologies.

You will contribute to thermal, mechanical, electrical, and optical design integration activities,