Senior Optical Packaging Engineer (Photonics)

GPD Optoelectronics Corp.; Salem (NH); On-site; USD 120,000 - 180,000; Full time

Job summary

GPD Optoelectronics Corp. in Salem, NH is seeking a Lead Optical Packaging Engineer to design, qualify, and manufacture advanced packaging for photodiode devices and micro optics. You will guide design teams, manage DOE studies, and ensure manufacturability and cost targets while aligning with customer specs.

Local candidates preferred; travel is likely <10%. The role reports to the COO and is based at our Salem, NH facility, requiring 8+ years in semiconductor/photonics die packaging and strong

Qualifications

• BS in mechanical engineering, material science, or closely related technical discipline.
• MSME with 6+ years of direct semiconductor or photonics die packaging experience preferred.

Responsibilities

• Perform all aspects of package design and verification through NPI and engineering change.
• Develop and document manufacturing techniques for backend photodiode assembly.
• Select techniques to solve problems and enhance product yield and process flows.
• Establish high yielding, cost effective processes based on product need.
• Develops and executes DOE for process optimization.
• Evaluate and validate process and design alternatives for manufacturability.
• Provide technical leadership to manufacturing engineers to drive new product/process into manufacturing.
• Ensure processes are robust and repeatable against product specifications and cost.

Skills

Package design

Die attach

Wirebonding

Flip chip attach

Seam seal

Laser mark

Design of Experiments

Statistics

Technical leadership

Education

BS in mechanical engineering or material science

MSME with 6+ years in semiconductor/photonics packaging

Job description

GPD Optoelectronics Corp. in Salem, NH is seeking a Lead Optical Packaging Engineer to design, qualify, and manufacture advanced packaging for photodiode devices and micro optics. You will guide design teams, manage DOE studies, and ensure manufacturability and cost targets while aligning with customer specs.

Local candidates preferred; travel is likely <10%. The role reports to the COO and is based at our Salem, NH facility, requiring 8+ years in semiconductor/photonics die packaging and strong