Lead Optical Packaging Engineer

GPD Optoelectronics Corp.; Salem (NH); On-site; USD 120,000 - 180,000; Full time

Job summary

GPD Optoelectronics Corp. in Salem, NH is seeking a Lead Optical Packaging Engineer to design, qualify, and manufacture advanced packaging for photodiode devices and micro optics. You will guide design teams, manage DOE studies, and ensure manufacturability and cost targets while aligning with customer specs.

Local candidates preferred; travel is likely <10%. The role reports to the COO and is based at our Salem, NH facility, requiring 8+ years in semiconductor/photonics die packaging and strong

Qualifications

• BS in mechanical engineering, material science, or closely related technical discipline.
• MSME with 6+ years of direct semiconductor or photonics die packaging experience preferred.

Responsibilities

• Perform all aspects of package design and verification through NPI and engineering change.
• Develop and document manufacturing techniques for backend photodiode assembly.
• Select techniques to solve problems and enhance product yield and process flows.
• Establish high yielding, cost effective processes based on product need.
• Develops and executes DOE for process optimization.
• Evaluate and validate process and design alternatives for manufacturability.
• Provide technical leadership to manufacturing engineers to drive new product/process into manufacturing.
• Ensure processes are robust and repeatable against product specifications and cost.

Skills

Package design

Die attach

Wirebonding

Flip chip attach

Seam seal

Laser mark

Design of Experiments

Statistics

Technical leadership

Education

BS in mechanical engineering or material science

MSME with 6+ years in semiconductor/photonics packaging

Job description

We are scaling tomorrow's world, TODAY! We continue to expand our team, a team is shaping the future of our industry and share our passion to reveal the invisible!

GPD Optoelectronics is seeking an accomplished technical lead engineer with a diverse skill set to join our team.

As the Lead Optical Packaging Engineer, you will oversee developing advanced packaging solutions including package design, material selections, fabrication processing, qualification, and documentation. You’ll work closely with design engineers, process engineers, supply chain, operations technicians, facilities, and outside consultants.

Responsibilities include the development of advanced packaging solutions of photodiode devices, electronics, and micro optics for various market segments. You will provide packaging solutions which meet demanding product requirements while balancing the need for reliability and cost. You will follow the NPI gate process, ensure the products meet both internal and customer specifications as required, and that the product is designed for manufacturing. You will also be responsible for ensuring the repeatability and reproducibility of our products and make suggestions where applicable on next gen fabrication/assembly capabilities.

This full-time, exempt position will report to the COO and will be located at our Salem, NH facility.

• Preference will be given to candidates currently located within commutable distance to Salem, NH.

Responsibilities

• Perform all aspects of package design and verification through the NPI and engineering change process to deliver robust, manufacturable solutions. This will be achieved through full understanding of product performance, material implications, project costs and design for manufacture.
• Develop and document manufacturing techniques, materials, tools and processes related to backend Photodiode assembly.
• Performs analyses and selects techniques to solve problems and enhance product yield and process flows.
• Establish high yielding, cost effective processes based on product need and customer requirements.
• Develops and executes Design of Experiments (DOE) for process optimization utilizing appropriate statistical analysis.
• Evaluates and validates process and design alternatives based on product manufacturability.
• Perform technical leadership to a manufacturing engineer to drive a new product or process into manufacturing.
• Provides processes that are robust and repeatable against product specifications and that support the quoted cost.
• Lead the design and manufacturing team in the direction for improving and streamlining existing processes for increased package assembly quality and reduced assembly time.
• Mentor junior staff.
• Other duties as assigned by your manager.

Experience

• BS in mechanical engineering, material science, or closely related technical discipline with at least 8 years of industrial experience in semiconductor or photonics die packaging.
• Fluent with material properties, packaging techniques, and manufacturing disciplines including die attach methods, wirebonding, flip chip die attach, seam seal, laser mark, and related qualification techniques.
• Demonstrated experience of working with diverse engineering disciplines.
• Strong manufacturing experience which insures high yield along with controlled process.

Preferred Experience

• MSME with 6+ years of direct semiconductor or photonics die packaging experience.
• 5 years plus of technical leadership experience in crossfunctional teams.
• Design for Six Sigma practices including Root Cause Analysis, Design of Experiments, etc.
• General awareness of FEAbased analysis techniques as related to photonics and PIC package designs would be distinct advantage.

MISC:

• Able to lift up to 20lbs
• Travel may be required, likely less than 10%

GPD provides equal employment opportunities to all employees and applicants for employment and prohibits discrimination and harassment of any type without regard to race, color, religion, age, sex, national origin, disability status, genetics, protected veteran status, sexual orientation, gender identity or expression, or any other characteristic protected by federal, state or local laws. This policy applies to all terms and conditions of employment, including recruiting, hiring, placement, promotion, termination, layoff, recall, transfer, leaves of absence, compensation and training.

About GPD

At GPD Optoelectronics, we believe that by operating with integrity and trust we drive constant organizational improvement, which strengthens our relationships with our employees and customers. Customer success remains our highest priority, so we strive to deliver high-quality products on time, and provide unparalleled service, responsiveness, and collaboration.
Founded in 1973 as Germanium Power Devices Corp, we began by making high-quality germanium transistors. Since the early 1980’s we have earned our place as a trusted manufacturer of both germanium and indium gallium arsenide photodiodes. We are located in Salem, NH.