Senior Multiphysics IC Packaging Engineer

University of Texas; Austin (TX); On-site; USD 120,000 - 190,000; Full time

Benefits offered by this job

Competitive health benefits

Generous paid vacation

Tuition assistance

Robust training access

Employee discount programs

Job summary

A prestigious educational institution in Austin, Texas is seeking an experienced professional for a role in semiconductor packaging involving multiphysics simulations and interconnect modeling. The ideal candidate will have an advanced degree and extensive experience with EDA tools. This role involves collaboration with engineering teams and vendors to develop and refine simulation workflows. The position offers competitive benefits, paid time off, and opportunities for professional growth and training.

Qualifications

• 3+ years of hands-on experience in multiphysics simulations for advanced packaging.
• Strong expertise in EDA tools and simulation workflows.
• Experience with high-speed interconnect modeling.

Responsibilities

• Manage semiconductor packaging simulations for advanced integration.
• Collaborate with EDA vendors to refine simulation flows.
• Mentor junior engineers and guide technical strategies.

Skills

Multiphysics simulations

EDA/EM tools

Scripting/automation skills

Interconnect modeling

Education

MS or PhD in Electrical Engineering, Applied Physics

Tools

Ansys HFSS

Cadence Sigrity

Synopsys RaptorX

COMSOL

Job description

A prestigious educational institution in Austin, Texas is seeking an experienced professional for a role in semiconductor packaging involving multiphysics simulations and interconnect modeling. The ideal candidate will have an advanced degree and extensive experience with EDA tools. This role involves collaboration with engineering teams and vendors to develop and refine simulation workflows. The position offers competitive benefits, paid time off, and opportunities for professional growth and training.