Senior Integration Engineer - Heterogeneous IC Packaging

University of Texas at Austin; Austin (TX); On-site; USD 90,000 - 130,000; Full time

Benefits offered by this job

Health benefits

Tuition assistance

Paid vacation / holidays

Library access / museums access

Job summary

The University of Texas at Austin's Texas Institute for Electronics is seeking an Integration Engineer or Senior Integration Engineer to advance heterogeneous integration test vehicles. You will install and qualify toolsets and help establish best known methods to improve yield and reliability in advanced packaging projects.

Candidates should have a semiconductor engineering background, with progression from bachelor’s to master’s/PhD for senior roles, and hands-on cleanroom experience.

Qualifications

• Bachelor’s degree in semiconductor engineering or related fields.
• Five years of experience including Cu BEOL interconnects and copper DD unit processes.
• Experience with W2W or D2WHB preferred; strong data analytical skills and cleanroom experience.

Responsibilities

• Drive unit process engineers and tool/material vendors toward defined targets for integrated test vehicles.
• Develop short-loop and full integrated processes for heterogeneous integration prototypes.
• Hands-on role in the cleanroom with shared ownership of critical unit processes.
• Define process windows and resolve excursions through structured troubleshooting.
• Experiment design and evaluation on test vehicles for mechanical/electrical performance.
• Mentor junior engineers/students and communicate effectively.

Skills

Cu BEOL interconnects

3D ICs

Data analytics

Education

Bachelor’s degree in semiconductor engineering or related field

Master’s or doctoral degree in semiconductor engineering or related field

Tools

JMP

Python

Job description

The University of Texas at Austin's Texas Institute for Electronics is seeking an Integration Engineer or Senior Integration Engineer to advance heterogeneous integration test vehicles. You will install and qualify toolsets and help establish best known methods to improve yield and reliability in advanced packaging projects.

Candidates should have a semiconductor engineering background, with progression from bachelor’s to master’s/PhD for senior roles, and hands-on cleanroom experience.