Module Equipment Development Engineer

100 Intel Corporation

Hillsboro (OR)

Hybrid

USD 115,000 - 220,000

Full time

3 days ago
Be an early applicant

A complete application in a minute

Tailored resume and cover letter, ready to send.

Get past ATS filters

Job summary

Intel Corporation in Hillsboro, Oregon, is seeking a Module Equipment Development Engineer to lead development and optimization of semiconductor manufacturing equipment and processes. You will drive new process capabilities and enable high-performance devices while partnering with global teams to advance future technologies.

Responsibilities include designing experiments, collaborating with suppliers, and supporting technology transfer to high-volume manufacturing with a focus on yield

Qualifications

  • Bachelor's degree in a STEM field with 4+ years in semiconductor processing.
  • Experience in lithography, etching, thin film deposition, or planarization.
  • Familiarity with JMP, MATLAB, or Python for data analysis.

Responsibilities

  • Develop Equipment capable of delivering on new process requirements in Dielectrics Thin Films.
  • Develop robust Equipment modules transferable to high-volume manufacturing.
  • Collaborate with suppliers to evaluate and implement novel technologies.
  • Support technology transfer to high-volume manufacturing through training and audits.
  • Design, execute, and analyze experiments to optimize manufacturing processes.
  • Perform feasibility studies to support future device architectures and roadmaps.
  • Use SPC and DOE to guide process improvements and yield enhancements.
  • Partner with cross-functional teams to ensure seamless process integration.

Skills

Semiconductor processing experience
Lithography
Etching
Thin film deposition
Planarization
Process characterization
Statistical analysis tools (MATLAB, J*
Python
Materials characterization techniques

Education

Bachelor's degree in Materials Science or related STEM field
Master's degree in relevant STEM field
PhD in Materials Science / Chemical Engineering / Physics / Chemistry

Tools

JMP
MATLAB
Python
SEM
TEM
XPS
Ellipsometry

Job description

Job Details

Job Description:

The Role and Impact: As a Module Equipment Development Engineer, you will lead the development and optimization of advanced semiconductor manufacturing equipment and processes, enabling Intel to deliver high-performance devices. Your contributions will directly impact Intel's technological leadership in the semiconductor industry and advance the capabilities of future technologies.

Business Group: Intel Foundry Technology Development is focused on advancing semiconductor process engineering and delivering world-class manufacturing solutions that power Intel's product innovation. Working within this group, you will collaborate with global teams to develop cutting-edge technologies that enable the design and production of leading-edge devices, helping Intel maintain its leadership in a competitive and fast-paced market.

Key Responsibilities
  • Develop Equipment capable of delivering on new process requirements in Dielectrics Thin Films.
  • Develop robust Equipment modules that can be transferred seamlessly to high volume manufacturing.
  • Collaborate with equipment and material suppliers to evaluate, qualify, and implement novel technologies into manufacturing processes.
  • Support technology transfer to high-volume manufacturing through training, audits, and maintaining process consistency across sites.
  • Design, execute, and analyze experiments to optimize advanced manufacturing processes, including material selection, equipment metrology, and parameter tuning.
  • Perform feasibility studies and pathfinding activities to support innovative device architectures and future technology roadmaps.
  • Utilize advanced data analysis methods, including Statistical Process Control (SPC) and Design of Experiments (DOE), to guide process improvements and enhance yield.
  • Partner with cross-functional teams to ensure seamless process integration and manufacturability.
Qualifications
Minimum Qualifications
  • Bachelor's degree in Materials Science, Chemical Engineering, Physics, Chemistry, Electrical Engineering, or related STEM field, with 4+ years of industry experience in semiconductor processing OR Master's degree in relevant STEM fields with 3+ years of domain-specific experience OR PhD in Materials Science, Chemical Engineering, Physics, Chemistry, or related STEM field with 6+ months experience in semiconductor processing
  • Industry experience in semiconductor processing/domain-specific experience includes one of more of the following: Proficiency in semiconductor processing techniques such as lithography, etching, thin film deposition, or planarization Expertise in process characterization methods and statistical analysis tools, such as JMP, MATLAB, or Python Familiarity with materials characterization techniques like SEM, TEM, XPS, or ellipsometry
Preferred Qualifications
  • Hands-on experience working with equipment troubleshooting, maintenance, or development in collaboration with suppliers
  • Experience at a Semiconductor manufacturing tool supplier.
  • Knowledge of manufacturing technologies including vacuum processes, ALD, or CVD
  • Strong problem-solving skills with the ability to manage multiple tasks in a fast-paced environment
  • Collaborative mindset with a proven track record of working across interdisciplinary teams to achieve shared goals
Job Information

Job Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Oregon, Hillsboro Additional Locations:

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $115,110.00-219,550.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role: This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site.

  • Job posting details (such as work model, location or time type) are subject to change.
  • ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.
Get your free, confidential resume review.

or drag and drop your file here.

Similar jobs

Similar jobs worth comparing

Advanced Packaging Module Development Engineer
Advanced Packaging Module Development Engineer

Intel Corporation • Hillsboro (OR)

On-site
USD 134,000 - 255,000
Intel Foundry Module Development Engineer
Intel Foundry Module Development Engineer

Intel Corporation • Hillsboro (OR)

Hybrid
USD 134,000 - 255,000
Health benefits
Stock bonuses
Retirement plan
+1
Module Development Engineer
Module Development Engineer

Intel Corporation • Hillsboro (OR)

Hybrid
USD 134,000 - 255,000
Stock bonuses
Health benefits
Retirement plan
+1
Senior / Staff Dry Etch Process Development Engineer
Senior / Staff Dry Etch Process Development Engineer

Intel Corporation • Rio Rancho (NM)

On-site
USD 156,000 - 255,000
Stock bonuses
Health benefits
Retirement plan
+1
Module Engineer PhD Intern New 2027
Module Engineer PhD Intern New 2027

Intel Corporation • Hillsboro (OR)

On-site
USD 121,000 - 122,000
Stock bonuses
Health insurance
Retirement plan
+1
Technology Development Foundry Engineering – Staff Engineer
Technology Development Foundry Engineering – Staff Engineer

Intel Corporation • Hillsboro (OR)

Hybrid
USD 134,000 - 255,000
Hybrid work model
Stock bonuses
Health benefits
Member of Technical Staff - Thin Films Engineer
Member of Technical Staff - Thin Films Engineer

Intel Corporation • Hillsboro (OR)

Hybrid
USD 134,000 - 255,000
Hybrid work model
Stock bonuses
Health benefits
Intel Foundry Module Development Engineer - CMP
Intel Foundry Module Development Engineer - CMP

Intel Corporation • Hillsboro (OR)

Hybrid
USD 134,000 - 255,000
Stock bonuses
Health plans
Hybrid work model
Module Engineering PhD Intern
Module Engineering PhD Intern

Intel Corporation • Hillsboro (OR)

On-site
USD 121,000 - 122,000
Stock bonuses
Health benefits
Retirement plan
+1
Senior / Staff Dry Etch Process Development Engineer
Senior / Staff Dry Etch Process Development Engineer

Intel Corporation • Albuquerque (NM)

On-site
USD 156,000 - 255,000
Stock bonuses
Health benefits
Retirement plan