Senior Metrology & Module Development Engineer

Intel

Hillsboro (OR)

On-site

USD 140,000 - 190,000

Full time

2 days ago
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Job summary

Intel's Advanced Packaging Technology Development (APTD) Metrology Group seeks a Senior Module Development Engineer to drive metrology strategy and equipment readiness from tool installation through process validation, ensuring capabilities meet program demands.

The role blends strategic roadmap leadership with hands‑on problem solving across process integration, AI, automation, and advanced process control in a fast‑paced semiconductor environment.

Qualifications

  • Demonstrated metrology expertise and hands-on experience with next-gen metrology equipment.
  • Ability to translate industry knowledge into a forward-looking roadmap for metrology capabilities.
  • Strong engagement with the global metrology landscape and industry standards.

Responsibilities

  • Drive technology development and enablement across high‑volume manufacturing and future nodes.
  • Lead design and development of metrology and inspection processes including material selection and system design.
  • Define and own the metrology group's long-range technology roadmap.
  • Perform pathfinding activities to support process and hardware development for future program needs.
  • Qualify metrology equipment end-to-end from installation to full fab readiness.
  • Serve as the primary technical resource for fab support and tool fleet performance.
  • Recommend equipment and process modifications to improve production efficiency.
  • Collaborate with suppliers to co-define next-gen tool capabilities and roadmaps.

Skills

Metrology expertise
Equipment development
Process integration
Advanced process control
AI and automation
Senior program leadership

Job description

Intel's Advanced Packaging Technology Development (APTD) Metrology Group seeks a Senior Module Development Engineer to drive metrology strategy and equipment readiness from tool installation through process validation, ensuring capabilities meet program demands.

The role blends strategic roadmap leadership with hands‑on problem solving across process integration, AI, automation, and advanced process control in a fast‑paced semiconductor environment.

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