Senior Metrology & Module Development Engineer

Intel Corporation; Hillsboro (OR); On-site; USD 156,000 - 220,000; Full time

Benefits offered by this job

Health benefits

Retirement plan

Vacation

Job summary

Intel Corporation's Advanced Packaging Technology Development (APTD) Metrology Group seeks a Senior Module Development Engineer to own end-to-end metrology tool qualification and drive strategic roadmaps. You will translate industry trends into the technical plan and lead cross-functional teams across process integration, module engineering, AI, and automation to advance next-generation packaging.

The role combines hands-on metrology expertise with strategic influence, ensuring tool readiness

Qualifications

• Bachelor's degree in STEM with 6+ years of relevant experience.
• Master's degree with 4+ years; PhD with 2+ years possible.
• Expertise in semiconductor processing, wafer-level assembly, or cleanroom environments.
• Proficiency in process development methodologies, SPC, and manufacturing process improvement.
• Technical expertise in module engineering or fab process/hardware technology development.

Responsibilities

• Drive technology development and enablement across both high-volume manufacturing and future technology nodes.
• Lead design and development of metrology and inspection processes for new architectures.
• Define and own the metrology group's long-range technology roadmap.
• Perform pathfinding activities to enable new device architectures and roadmaps.
• Conduct technology feasibility studies with theoretical simulations and practical methods.
• Evaluate and qualify next-generation metrology equipment end-to-end.
• Serve as primary technical resource for fab support, driving issue resolution.
• Recommend and implement equipment/process modifications to improve production.
• Collaborate with suppliers to co-develop next-generation tool capabilities.
• Stay current on industry trends and translate into forward-looking needs.
• Lead metrology module development across concurrent programs with recipe development and SPC.
• Design rapid inline feedback mechanisms for faster insight.
• Collaborate with AI/ML teams to develop predictive process control.
• Represent the metrology group in cross-functional program reviews.

Skills

Semiconductor processing

Wafer-level assembly

Cleanroom environments

Process development

Statistical process control

Module engineering

Python

Dashboard creation

Scripting

Vendor collaboration

Education

Bachelor's degree in STEM fields

Master's degree in related fields

PhD in related fields

Tools

Data analysis tools

AI/ML tools

Job description

Intel Corporation's Advanced Packaging Technology Development (APTD) Metrology Group seeks a Senior Module Development Engineer to own end-to-end metrology tool qualification and drive strategic roadmaps. You will translate industry trends into the technical plan and lead cross-functional teams across process integration, module engineering, AI, and automation to advance next-generation packaging.

The role combines hands-on metrology expertise with strategic influence, ensuring tool readiness