Senior Metrology & Advanced Packaging Engineer
intel
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Benefits offered by this job
Job summary
Intel's Advanced Packaging Technology Development (APTD) Metrology Group seeks a Senior Module Development Engineer to advance next‑gen metrology in pilot and production settings. You will own end‑to‑end qualification of new tools, define measurement strategies, and lead cross‑functional collaborations across process integration and AI/automation teams.
The role requires deep hands‑on metrology expertise and strategic insight to translate industry trends into a forward‑looking roadmap while
Qualifications
- Bachelor’s, Master’s, or PhD in a relevant STEM field with metrology experience.
- Experience in semiconductor processing, wafer-level assembly, or cleanroom environments.
- Strong knowledge of SPC, process development, and equipment integration.
Responsibilities
- Drive metrology development and enablement across both high-volume manufacturing and future technology nodes.
- Lead the design and development of metrology and inspection processes for new product architectures.
- Define and own the metrology group's long-range technology roadmap.
- Lead end-to-end qualification of new metrology equipment from installation to fab readiness.
- Collaborate with AI, MPC, and process control teams to advance predictive monitoring.
Skills
Education
Tools
Job description
Intel's Advanced Packaging Technology Development (APTD) Metrology Group seeks a Senior Module Development Engineer to advance next‑gen metrology in pilot and production settings. You will own end‑to‑end qualification of new tools, define measurement strategies, and lead cross‑functional collaborations across process integration and AI/automation teams.
The role requires deep hands‑on metrology expertise and strategic insight to translate industry trends into a forward‑looking roadmap while
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