Advanced Packaging Metrology Engineering Leader — On-Site

Intel Corporation; Hillsboro (OR); On-site; USD 156,000 - 255,000; Full time

Job summary

Intel Corporation in Hillsboro, Oregon, seeks an Advanced Packaging Metrology Engineering Manager to lead a high‑performing team shaping wafer‑level processing and packaging technology. You will drive long‑term strategies, enable manufacturing readiness, and oversee cross‑functional collaborations to deliver robust, scalable solutions.

The role demands strategic thinking, strong leadership, and a commitment to innovation, mentorship, and inclusive team culture in a fast paced semiconductor

Qualifications

• Bachelor’s degree in science, engineering, or related STEM field with 6+ years of relevant experience; OR Master’s degree in a related STEM field with 4+ years of relevant experience; OR PhD in a related STEM field with 4+ years of relevant experience.
• Relevant experience can be semiconductor wafer or assembly process, equipment, or materials development.
• Process development methodology, project management, and schedule-based execution.
• Lead programs from strategy formation through high-volume production.

Responsibilities

• Lead and inspire a team of engineers to develop advanced wafer processing and packaging solutions that push the boundaries of semiconductor technology.
• Drive technology enablement, feasibility studies, and module improvement initiatives aligned with Intel’s roadmap.
• Ensure successful demonstrations of manufacturing capabilities at high volumes and manage technology transfers to global sites.
• Collaborate with cross-functional teams to deliver process solutions meeting device specs while optimizing safety, quality, and cost.

Skills

Leadership

Strategic thinking

Cross-functional collaboration

Mentoring

Communication

Problem solving

Education

Bachelor’s degree in STEM

Master’s degree in STEM

PhD in STEM

Tools

Metrology equipment

Wafer-level packaging tools

Process development tools

Job description

Intel Corporation in Hillsboro, Oregon, seeks an Advanced Packaging Metrology Engineering Manager to lead a high‑performing team shaping wafer‑level processing and packaging technology. You will drive long‑term strategies, enable manufacturing readiness, and oversee cross‑functional collaborations to deliver robust, scalable solutions.

The role demands strategic thinking, strong leadership, and a commitment to innovation, mentorship, and inclusive team culture in a fast paced semiconductor