Senior Electroplating Process Engineer

ChipAdd Corp.; City of Binghamton (NY); On-site; USD 90,000 - 155,000; Full time

Benefits offered by this job

Equity

Job summary

ChipAdd Corp. in Binghamton, NY, is seeking an experienced Senior Electrochemical Process Engineer to develop and optimize copper plating and related chemistries.

You will own the full wet process flow, set up analytical methods, and drive DOE-based process windows while ensuring safety and environmental compliance. You will work with CAD tools to design plating racks and benches, and contribute to transfer of processes to manufacturing and partners.

Qualifications

• MS or PhD in Chemical Engineering, Materials Science, Chemistry or related field.
• 5–7 years of hands-on electroplating and electrochemical process development.
• Experience with electroplating and electroless deposition (copper preferred).

Responsibilities

• Develop electrochemical processing methods (electroplating, electroless deposition, patterned plating).
• Optimize plating chemistries (bath composition, additives, pH, temp, agitation) and current waveforms.
• Design wet process flow from surface prep to deposition, rinse, dry, and anneal; manage adhesion and film stress.
• Set up bath analysis (titration, XRF, ICP) and define bath-life rules.
• Plan and run DOEs to map process windows and relate parameters to film properties.
• Characterize deposits with SEM/EDS, XRD, profilometry and adhesion testing.
• Evaluate corrosion and galvanic behavior in data center coolants; develop protective finishes.
• Own EHS for wet chemistry; ensure OSHA/EPA and NYS compliance.
• Design racks and plating tools in CAD; write SOPs and control plans.

Skills

Electroplating

Process development

DOE

SPC

Python

Lab safety

CAD basics

Education

MS or PhD in Chemical Engineering, Materials Science, or Chemistry

Tools

SolidWorks

Fusion 360

3D printing

XRF

SEM/EDS

Job description

• Salary range: $90,000 – $155,000 per year + equity

Copper doesn't grow on silicon by itself. You'll invent the chemistry that makes it happen, and make sure it lasts.

About CHIPADD

CHIPADD is based in Binghamton, NY, close to the original birthplace of IBM, and we have leadership based in Silicon Valley as well. Our culture runs on curiosity, execution and a deep commitment to the mission.

What You'll Do

• Develop new electrochemical processing methods. Knowledge of electroplating, electroless deposition and selective or patterned plating a must.
• Develop and optimize plating and electroless chemistries, including bath composition, additives (accelerators, suppressors and levelers), pH, temperature, agitation and current waveforms such as DC, pulse and pulse-reverse
• Engineer the full wet process flow, from surface preparation, seed and barrier layers and activation through deposition, rinse, dry and anneal, while managing adhesion, film stress and thermal budget on the silicon
• Set up bath analysis and control (titration, CVS, Hull cell, XRF or ICP) and define replenishment, dummy plating and bath-life rules
• Plan and run designs of experiments (DOEs) to map process windows and correlate parameters with thickness uniformity, grain structure, purity, voiding, adhesion and surface finish
• Characterize deposits and interfaces with optical microscopy, SEM/EDS, cross-sectioning, XRD, profilometry, and adhesion and stress testing
• Evaluate corrosion and galvanic behavior of our copper features, metallization stacks and finishes in data center coolants, using electrochemical methods (potentiodynamic polarization, EIS, Tafel analysis) and long-duration immersion and flow testing, and develop protective finishes or inhibitor strategies where needed
• Own environmental, health and safety (EHS) for our wet chemistry: chemical selection and approval, SDS management, storage and segregation, PPE, fume hood and wet bench requirements, spill response, waste handling and disposal, and compliance with OSHA, EPA and New York State rules
• Design racks, fixtures, masks and plating cell components in CAD, and 3D print or source them so experiments move fast; help specify plating tools and wet benches as we scale
• Write SOPs, work instructions and process control plans so every bath and every run is repeatable, and transfer processes to manufacturing and partners

What You Bring

• MS or PhD in Chemical Engineering, Materials Science, Chemistry or a related field, ideally with a focus on electrochemistry
• 5–7 years of hands‑on electroplating and electrochemical process development, ideally in semiconductor, advanced packaging, PCB or MEMS manufacturing
• Deep experience with electroplating and electroless deposition (copper strongly preferred; nickel, gold, palladium or tin also valuable), including bath chemistry, additive behavior and process control
• Working knowledge of semiconductor manufacturing processes such as metallization, seed and barrier deposition, lithography and patterning, wet cleans and CMP
• Solid grounding in corrosion fundamentals: thermodynamics and kinetics, Pourbaix diagrams, galvanic coupling, pitting and crevice corrosion, and how to test for them
• Proven ability to run a safe chemical lab, including hazard assessments, chemical hygiene plans, waste management and regulatory compliance
• Basic mechanical skills: CAD (SolidWorks, Fusion 360 or similar), 3D printing, and working knowledge of engineering materials and chemical compatibility
• Experience characterizing deposits and interfaces (SEM/EDS, cross‑sections, XRF, adhesion and stress measurements)
• Strong experimental and statistical mindset, including DOE and SPC (JMP, Minitab or Python)

Bonus Points

• Experience with TSV, copper pillar, RDL or damascene plating
• Experience with electroforming or electrochemical additive manufacturing of 3D metal structures
• Corrosion testing of liquid cooling hardware, or experience with data center coolants such as PG25 or deionized water
• Experience specifying or running production plating tools and wet benches
• EHS training or certifications such as OSHA 30, HAZWOPER or CHMM

Who Thrives Here

Hungry. You want the hard problem, and you'd rather ship a working prototype on Friday than a perfect slide deck next month.

Humble. You let the data win the argument, especially when it disagrees with you.

Smart. You learn fast, think from first principles and know when to go deep versus when to move.

Hands‑on. You have a track record of building real things that work, and you have the scars (and the spreadsheets) to prove it.

Data‑driven. You design experiments, instrument everything and make decisions from the numbers.

What We Offer

• Competitive base salary plus meaningful early‑stage equity
• Medical, dental and vision coverage and paid time off
• A seat at the table on a technology that could become the industry standard
• Southern Tier New York living: short commutes, four real seasons, Finger Lakes weekends and an affordable cost of living

Equal opportunity employer