Senior MEMS Packaging Engineer - Systems Leader

Analog Devices; Wilmington (MA); On-site; USD 110,000 - 152,000; Full time

Benefits offered by this job

Discretionary performance-based bonus

Medical, vision and dental coverage

401k

Paid vacation

Holidays

Sick time

Job summary

Analog Devices, Inc. seeks a Senior Systems Semiconductor Packaging Engineer to lead advanced packaging development for MEMS sensor products across automotive, industrial, and healthcare markets.

You will translate product and customer requirements into robust, manufacturable solutions through the full lifecycle. Join a cross-functional team working with applications, quality, reliability, and external vendors to improve performance, yield, and time to market while addressing manufacturability

Qualifications

• Strong experience in semiconductor packaging and manufacturing processes, with the ability to support package development from concept through release
• Strong understanding of substrates, adhesives, underfills, mold compounds, and interconnect materials used in semiconductor packaging
• Experience applying reliability and manufacturability principles to package design, qualification readiness, and process optimization
• Hands-on experience with 3D CAD and engineering analysis tools such as SolidWorks and ANSYS
• Demonstrated ability to apply DOE, PFMEA, SPC, 8D, RCA, and related methods to solve technical and manufacturing challenges
• Ability to work effectively across applications, manufacturing, quality, reliability, and external partner teams
• Strong communication skills with the ability to translate technical issues and requirements clearly across stakeholders

Responsibilities

• Packaging Development: Lead project-level semiconductor packaging design activities from product conception through manufacturing readiness
• Manufacturability and Reliability: Drive design for manufacturability and design for reliability through process characterization, risk assessment, and structured problem solving
• Root Cause and Yield Improvement: Partner with quality and reliability teams to perform root cause analysis, improve yield, and implement corrective and preventive actions
• Engineering Analysis: Perform detailed package analysis using 3D CAD tools such as SolidWorks and simulation tools such as ANSYS to evaluate mechanical and process performance
• Process and Quality Methods: Apply engineering methodologies including control plans, PFMEA, DOE, SPC, 8D, and RCA to improve product and process outcomes
• Customer Requirements Translation: Partner with Applications Engineering to translate customer specifications into clear technical direction for internal development teams
• OSAT Collaboration: Work with OSAT partners to support rapid prototyping, early builds, and preliminary qualification activities
• Vendor and Assembly Readiness: Help reduce time to market by aligning package designs with vendor assembly capabilities and manufacturing constraints
• Cross-Functional Leadership: Collaborate with multidisciplinary teams to support execution, issue resolution, and product success across development phases

Skills

Semiconductor packaging

Packaging design

3D CAD tools

ANSYS

DOE/PFMEA

Cross-functional collaboration

Communication

Strong packaging knowledge

Education

Bachelor's or Master’s in Mechanical/Materials/Electrical Engineering

Tools

SolidWorks

ANSYS

Job description

Analog Devices, Inc. seeks a Senior Systems Semiconductor Packaging Engineer to lead advanced packaging development for MEMS sensor products across automotive, industrial, and healthcare markets.

You will translate product and customer requirements into robust, manufacturable solutions through the full lifecycle. Join a cross-functional team working with applications, quality, reliability, and external vendors to improve performance, yield, and time to market while addressing manufacturability