Semiconductor Packaging Engineer

Analog Devices; Wilmington (MA); On-site; USD 110,000 - 152,000; Full time

Benefits offered by this job

Discretionary performance-based bonus

Medical, vision and dental coverage

401k

Paid vacation

Holidays

Sick time

Job summary

Analog Devices, Inc. seeks a Senior Systems Semiconductor Packaging Engineer to lead advanced packaging development for MEMS sensor products across automotive, industrial, and healthcare markets.

You will translate product and customer requirements into robust, manufacturable solutions through the full lifecycle. Join a cross-functional team working with applications, quality, reliability, and external vendors to improve performance, yield, and time to market while addressing manufacturability

Qualifications

• Strong experience in semiconductor packaging and manufacturing processes, with the ability to support package development from concept through release
• Strong understanding of substrates, adhesives, underfills, mold compounds, and interconnect materials used in semiconductor packaging
• Experience applying reliability and manufacturability principles to package design, qualification readiness, and process optimization
• Hands-on experience with 3D CAD and engineering analysis tools such as SolidWorks and ANSYS
• Demonstrated ability to apply DOE, PFMEA, SPC, 8D, RCA, and related methods to solve technical and manufacturing challenges
• Ability to work effectively across applications, manufacturing, quality, reliability, and external partner teams
• Strong communication skills with the ability to translate technical issues and requirements clearly across stakeholders

Responsibilities

• Packaging Development: Lead project-level semiconductor packaging design activities from product conception through manufacturing readiness
• Manufacturability and Reliability: Drive design for manufacturability and design for reliability through process characterization, risk assessment, and structured problem solving
• Root Cause and Yield Improvement: Partner with quality and reliability teams to perform root cause analysis, improve yield, and implement corrective and preventive actions
• Engineering Analysis: Perform detailed package analysis using 3D CAD tools such as SolidWorks and simulation tools such as ANSYS to evaluate mechanical and process performance
• Process and Quality Methods: Apply engineering methodologies including control plans, PFMEA, DOE, SPC, 8D, and RCA to improve product and process outcomes
• Customer Requirements Translation: Partner with Applications Engineering to translate customer specifications into clear technical direction for internal development teams
• OSAT Collaboration: Work with OSAT partners to support rapid prototyping, early builds, and preliminary qualification activities
• Vendor and Assembly Readiness: Help reduce time to market by aligning package designs with vendor assembly capabilities and manufacturing constraints
• Cross-Functional Leadership: Collaborate with multidisciplinary teams to support execution, issue resolution, and product success across development phases

Skills

Semiconductor packaging

Packaging design

3D CAD tools

ANSYS

DOE/PFMEA

Cross-functional collaboration

Communication

Strong packaging knowledge

Education

Bachelor's or Master’s in Mechanical/Materials/Electrical Engineering

Tools

SolidWorks

ANSYS

Job description

About Analog Devices

Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. With revenue of more than $11 billion in FY25, ADI ensures today's innovators stay Ahead of What's Possible. Learn more at www.analog.com and on LinkedIn and X.

Senior Systems Semiconductor Packaging Engineer

About the Role As a Senior Systems Semiconductor Packaging Engineer, you will lead the development of advanced semiconductor packaging solutions for MEMS sensors used in automotive, industrial, medical, aerospace, and defense applications. You will work across the product lifecycle, from concept through manufacturing readiness, helping translate product and customer requirements into robust, scalable packaging solutions. This role calls for strong technical judgment, cross-functional collaboration, and hands-on problem solving. You will partner closely with teams across applications, quality, reliability, manufacturing, and external vendors to improve package performance, manufacturability, and time to market.

Key Responsibilities

• Packaging Development: Lead project-level semiconductor packaging design activities from product conception through manufacturing readiness
• Manufacturability and Reliability: Drive design for manufacturability and design for reliability through process characterization, risk assessment, and structured problem solving
• Root Cause and Yield Improvement: Partner with quality and reliability teams to perform root cause analysis, improve yield, and implement corrective and preventive actions
• Engineering Analysis: Perform detailed package analysis using 3D CAD tools such as SolidWorks and simulation tools such as ANSYS to evaluate mechanical and process performance
• Process and Quality Methods: Apply engineering methodologies including control plans, PFMEA, DOE, SPC, 8D, and RCA to improve product and process outcomes
• Customer Requirements Translation: Partner with Applications Engineering to translate customer specifications into clear technical direction for internal development teams
• OSAT Collaboration: Work with OSAT partners to support rapid prototyping, early builds, and preliminary qualification activities
• Vendor and Assembly Readiness: Help reduce time to market by aligning package designs with vendor assembly capabilities and manufacturing constraints
• Cross-Functional Leadership: Collaborate with multidisciplinary teams to support execution, issue resolution, and product success across development phases

Required Skills

• Strong experience in semiconductor packaging and manufacturing processes, with the ability to support package development from concept through release
• Strong understanding of substrates, adhesives, underfills, mold compounds, and interconnect materials used in semiconductor packaging
• Experience applying reliability and manufacturability principles to package design, qualification readiness, and process optimization
• Hands-on experience with 3D CAD and engineering analysis tools such as SolidWorks and ANSYS
• Demonstrated ability to apply DOE, PFMEA, SPC, 8D, RCA, and related methods to solve technical and manufacturing challenges
• Ability to work effectively across applications, manufacturing, quality, reliability, and external partner teams
• Strong communication skills with the ability to translate technical issues and requirements clearly across stakeholders

Preferred Education and Experience

• Bachelor’s or Master’s degree in Mechanical Engineering, Materials Science, Electrical Engineering, or a related technical field
• 5+ years of relevant experience in semiconductor packaging, process development, or manufacturing engineering
• Experience supporting MEMS, sensor, or advanced package development is a plus
• Experience working with OSAT partners and external manufacturing vendors is preferred

For positions requiring access to technical data, Analog Devices, Inc. may have to obtain export licensing approval from the U.S. Department of Commerce – Bureau of Industry and Security and/or the U.S. Department of State – Directorate of Defense Trade Controls. As such, applicants for this position – except US Citizens, US Permanent Residents, and protected individuals as defined by 8 U.S.C. 1324b(a)(3) – may have to go through an export licensing review process.

Analog Devices is an equal opportunity employer. We foster a culture where everyone has an opportunity to succeed regardless of their race, color, religion, age, ancestry, national origin, social or ethnic origin, sex, sexual orientation, gender, gender identity, gender expression, marital status, pregnancy, parental status, disability, medical condition, genetic information, military or veteran status, union membership, and political affiliation, or any other legally protected group. EEO is the Law: Notice of Applicant Rights Under the Law.

Job Req Type: Experienced Required Travel: Yes, 10% of the time Shift Type: 1st Shift/Days The expected wage range for a new hire into this position is $110,385 to $151,808. Actual wage offered may vary depending on work location, experience, education, training, external market data, internal pay equity, or other bona fide factors. This position qualifies for a discretionary performance-based bonus which is based on personal and company factors. This position includes medical, vision and dental coverage, 401k, paid vacation, holidays, and sick time, and other benefits.

Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. With revenue of more than $11 billion in FY25, ADI ensures today's innovators stay Ahead of What's Possible. Learn more at www.analog.com and on LinkedIn and X.

Come join ADI – a place where Innovation meets Impact. For more than 55 years, Analog Devices has been inventing new breakthrough technologies that transform lives. At ADI you will work alongside the brightest minds to collaborate on solving complex problems that matter from autonomous vehicles, drones and factories to augmented reality and remote healthcare. ADI fosters a culture that focuses on employees through beneficial programs, aligned goals, continuous learning opportunities, and practices that create a more sustainable future.