Senior Mainframe Hardware Architect (IBM Z)

Morgan-Stanley; Atlanta (GA); Vor Ort; USD 110.000 - 215.000; Vollzeit

Benefits dieser Stelle

Medical & dental insurance

Paid time off & holidays

401(k) with company match

Professional development support

Zusammenfassung

Morgan Stanley is seeking a Lead Cloud & Infrastructure Engineer at VP level to guide enterprise mainframe hardware lifecycle and resiliency. You will drive planning, installation, security, and automation initiatives across IBM Z platforms, DASD, Tape, and SAN/FICON fabrics.

The role requires coordinating with engineering, operations, risk and vendors, and participating in weekend work and on-call rotations to ensure continuous production readiness.

Qualifikationen

• Extensive mainframe hardware engineering experience in a large, regulated environment.
• Strong knowledge of IBM Z, DASD, Tape, FICON/SAN, Replication, and HMC/console infrastructure.
• Experience leading complex installations, migrations, and decommissions across teams.
• Hands-on with automation, scripting, or orchestration to improve operations.

Aufgaben

• Coordinate hardware installations, upgrades, migrations and decommissions with site readiness and change approvals.
• Manage vendor teams, escalations and ensure SLA delivery across components and timing infrastructure.
• Own hardware lifecycle end-to-end from demand planning through disposal and secure sanitization.
• Lead hardware evaluations for major refreshes including security, capacity and installation planning.
• Drive cyber recovery, encryption, patching and secure logging in the platform.

Kenntnisse

Mainframe hardware engineering

IBM Z

DASD

Tape

FICON/SAN

HMC/console infra

Automation scripting

AI adoption in infra

Tools

Brocade SAN

FICON fabric

APIs & orchestration tooling

Jobbeschreibung

Morgan Stanley is seeking a Lead Cloud & Infrastructure Engineer at VP level to guide enterprise mainframe hardware lifecycle and resiliency. You will drive planning, installation, security, and automation initiatives across IBM Z platforms, DASD, Tape, and SAN/FICON fabrics.

The role requires coordinating with engineering, operations, risk and vendors, and participating in weekend work and on-call rotations to ensure continuous production readiness.