Senior Lead, Advanced Packaging Supplier Enablement

Intel

Phoenix (AZ)

On-site

USD 164,000 - 232,000

Full time

3 days ago

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Job summary

Intel in the United States, Arizona, Phoenix is seeking an experienced engineer to lead substrate supplier development and qualification for advanced technologies. The role focuses on technology transfer readiness, data-driven yield improvements, and collaboration with global cross-functional teams to enable new manufacturing capacity.

Join a team driving continuous improvements in packaging substrates and wafer assembly, with periodic evening meetings and travel to supplier sites.

Qualifications

Minimum qualifications include a degree in engineering/physics/materials science with 9+ years of relevant experience; or a MS with 6+ years; or a PhD with 4+ years.
Experience with process integration methodologies and tools in semiconductor manufacturing.
Experience in advanced packaging, substrates, or semiconductor process development.

Responsibilities

Define process integration roadmaps and establish manufacturing procedures to meet technology transfer milestones.
Extract insights from structured and unstructured data, applying statistical analysis and coding techniques for yield improvement.
Lead low yield analysis and corrective actions to address quality excursions in high-volume production environments.
Drive continuous improvement initiatives to minimize defects and optimize process reliability.
Assess quality and reliability risks for manufacturing material and process changes, ensuring sustained product performance.
Collaborate with internal teams and external stakeholders to align process strategies with program goals.