Senior Laser Packaging Lead: Build & Scale Lasers

Edison Smart®; California (MO); On-site; USD 160,000 - 240,000; Full time

Job summary

Edison Smart® is seeking a Senior Laser Packaging Engineer to own and scale the high-power laser packaging capability. This hands-on leadership role will build the packaging platform, stand up the cleanroom, develop processes, and assemble a team that takes devices from wafer/bar level through to reliable packaged hardware.

The role covers packaging across die attach, soldering, wire bonding, and thermal stack-ups, with a focus on reliable production.

Qualifications

• Hands-on semiconductor or laser packaging background.
• Experience with high-power laser bars, VCSEL, PCSEL or related devices.
• Experience taking hardware from prototype to repeatable production.

Responsibilities

• Own high-power laser packaging across die attach, solder processes, wire bonding, subcarriers and thermal stack-ups.
• Develop packaging processes and ensure qualification and reliability.
• Oversee cleanroom buildout, equipment selection and qualification.
• Design thermal management and packaging for high-power laser devices.
• Build and lead a team of packaging engineers and technicians.
• Move packaging from R&D/prototype builds toward repeatable production.
• Collaborate closely with device, materials, test and reliability teams.

Skills

Laser packaging

Team leadership

Thermal modeling

Prototype to production

Job description

Edison Smart® is seeking a Senior Laser Packaging Engineer to own and scale the high-power laser packaging capability. This hands-on leadership role will build the packaging platform, stand up the cleanroom, develop processes, and assemble a team that takes devices from wafer/bar level through to reliable packaged hardware.

The role covers packaging across die attach, soldering, wire bonding, and thermal stack-ups, with a focus on reliable production.