Senior IC Packaging & Test Engineer — RF/High‑Speed

Future Ventures; Bastrop (TX); On-site; USD 140,000 - 190,000; Full time

Job summary

SpaceX Starlink seeks a Sr. IC Packaging Test Engineer to own packaging and wafer test for production, working with test equipment vendors and in-house chip/system designers to deliver production test solutions.

The role requires 5+ years of programming in C/C++/Visual/Python and a Bachelor's in a related engineering field, with extended hours for mission deadlines and ITAR compliance. On-site in Texas, USA.

Qualifications

• Bachelor's degree in electrical engineering, computer engineering, computer science, physics, or other applied engineering discipline.
• 5+ years of programming experience in C/C++/Visual/Python

Responsibilities

• Own electrical test equipment definition for packaging and wafer level production testing.
• Bring-up of test equipment and test programs for mass manufacturing.
• Create automated test equipment (ATE) test programs and test plans.
• Define full and comprehensive testing requirements to ensure product conformance.
• Schematic and electrical review for all test equipment.
• Supplier test interface for implementing new features, cost, and productivity improvements.
• Implement advanced testing solutions for SpaceX next generation products.

Skills

C/C++

Python

Visual

Education

Bachelor's degree in EE/CE/CS/Physics

Job description

SpaceX Starlink seeks a Sr. IC Packaging Test Engineer to own packaging and wafer test for production, working with test equipment vendors and in-house chip/system designers to deliver production test solutions.

The role requires 5+ years of programming in C/C++/Visual/Python and a Bachelor's in a related engineering field, with extended hours for mission deadlines and ITAR compliance. On-site in Texas, USA.