Director, IC Packaging Simulation & Engineering

Qualcomm; San Diego (CA); On-site; USD 227,300 - 340,900; Full time

Benefits offered by this job

Competitive annual discretionary bonus

Opportunities for RSU grants

Job summary

Qualcomm is seeking a Director to lead the Mechanical Simulation function in San Diego, California. This senior leadership role involves delivering mechanical simulation solutions to support chipsets and packaging technologies.

The ideal candidate will have substantial experience in FEA modeling and significant people management skills, overseeing engineering teams and driving strategic initiatives. Competitive salary, annual bonus and RSU grants available.

Qualifications

• Bachelor's degree in Chemical, Electrical, or Mechanical Engineering plus 8+ years of relevant experience.
• Master's degree and 7+ years of experience or PhD and 6+ years of experience also acceptable.
• Experience in managing engineering teams and people management.

Responsibilities

• Drive strategic alignment across IC package design and architecture.
• Oversee the development of mechanical FEA models.
• Champion innovation in simulation workflows and tooling.

Skills

Finite Element Analysis (FEA)

Mechanical Engineering

People Management

Electronic Packaging

Communication Skills

Education

Bachelor's degree in Engineering

Master's degree in Engineering

PhD in Engineering

Tools

ANSYS APDL

Materials Testing Equipment

Job description

Qualcomm is seeking a Director to lead the Mechanical Simulation function in San Diego, California. This senior leadership role involves delivering mechanical simulation solutions to support chipsets and packaging technologies.

The ideal candidate will have substantial experience in FEA modeling and significant people management skills, overseeing engineering teams and driving strategic initiatives. Competitive salary, annual bonus and RSU grants available.