Advanced IC Packaging Design Engineer

Draper; Boston (MA); On-site; USD 82,300 - 220,000; Full time

Job summary

Draper in Cambridge, MA is seeking an IC Packaging Design & Layout Engineer to create advanced packaging that meets performance, power and reliability targets for Draper’s hardware platforms.

You will lead high-speed layout, SI/PI analysis, and DF/M responsibilities, collaborating with silicon, thermal, mechanical, and manufacturing teams to deliver manufacturable package designs aligned with the company roadmap.

Qualifications

• Bachelor's degree in electrical engineering or related field.
• Advanced degree preferred.
• 5-10 years of experience in electrical engineering or related field.

Responsibilities

• Lead concept development for advanced packages (e.g., fan out wafer level, 2.5 D/3 D interposer, system in package).
• Produce detailed layout for substrates, interposers, and die to die routing using Siemens Xpedition.
• Own package-level SI/PI strategy, including high speed interfaces, PDN design, and decoupling strategy.
• Perform SPICE, EM, and S parameter simulations to validate SI, PDN, and crosstalk.
• Partner with mechanical engineers and analysts on die attach, under fill, molding, and thermal interface materials.
• Partner with silicon, RF, and board design engineers to co-optimize die floorplans and package interfaces.
• Serve as primary technical interface to substrate vendors, assembly houses, and OSATs.
• Author complete package build documentation, specifications, and test plans.
• Drive solutions to complex problems with limited direction and adapt to changes.

Skills

Packaging layout

High-speed design concepts

Electronic design

Design specifications

Communication

Organization & detail

Time management

Analytical problem-solving

Engineering theory & procedures

Education

Bachelors in electrical engineering

Advanced degree preferred

Tools

Siemens Xpedition

Ansys SIwave

HFSS

HyperLynx

Job description

Draper in Cambridge, MA is seeking an IC Packaging Design & Layout Engineer to create advanced packaging that meets performance, power and reliability targets for Draper’s hardware platforms.

You will lead high-speed layout, SI/PI analysis, and DF/M responsibilities, collaborating with silicon, thermal, mechanical, and manufacturing teams to deliver manufacturable package designs aligned with the company roadmap.