IC Packaging Design & Layout Engineer

Draper; Boston (MA); On-site; USD 82,300 - 220,000; Full time

Job summary

Draper in Cambridge, MA is seeking an IC Packaging Design & Layout Engineer to create advanced packaging that meets performance, power and reliability targets for Draper’s hardware platforms.

You will lead high-speed layout, SI/PI analysis, and DF/M responsibilities, collaborating with silicon, thermal, mechanical, and manufacturing teams to deliver manufacturable package designs aligned with the company roadmap.

Qualifications

• Bachelor's degree in electrical engineering or related field.
• Advanced degree preferred.
• 5-10 years of experience in electrical engineering or related field.

Responsibilities

• Lead concept development for advanced packages (e.g., fan out wafer level, 2.5 D/3 D interposer, system in package).
• Produce detailed layout for substrates, interposers, and die to die routing using Siemens Xpedition.
• Own package-level SI/PI strategy, including high speed interfaces, PDN design, and decoupling strategy.
• Perform SPICE, EM, and S parameter simulations to validate SI, PDN, and crosstalk.
• Partner with mechanical engineers and analysts on die attach, under fill, molding, and thermal interface materials.
• Partner with silicon, RF, and board design engineers to co-optimize die floorplans and package interfaces.
• Serve as primary technical interface to substrate vendors, assembly houses, and OSATs.
• Author complete package build documentation, specifications, and test plans.
• Drive solutions to complex problems with limited direction and adapt to changes.

Skills

Packaging layout

High-speed design concepts

Electronic design

Design specifications

Communication

Organization & detail

Time management

Analytical problem-solving

Engineering theory & procedures

Education

Bachelors in electrical engineering

Advanced degree preferred

Tools

Siemens Xpedition

Ansys SIwave

HFSS

HyperLynx

Job description

Overview:

Draper is an independent, nonprofit research and development company headquartered in Cambridge, MA. The 2,000+ employees of Draper tackle important national challenges with a promise of delivering successful and usable solutions. From military defense and space exploration to biomedical engineering, lives often depend on the solutions we provide. Our multidisciplinary teams of engineers and scientists work in a collaborative environment that inspires the cross-fertilization of ideas necessary for true innovation. For more information about Draper, visit www.draper.com.

Job Description Summary:

The IC Packaging Design & Layout Engineer is responsible for the end to end creation of advanced integrated circuit (IC) packaging solutions that meet performance, power, size, and reliability targets for Draper’s next generation hardware platforms. The role requires deep technical expertise in package architecture, high speed layout, signal integrity analysis, and design for manufacturability (DFM). The engineer will collaborate with cross functional teams—including silicon design, thermal/mechanical analysts, and manufacturing to deliver manufacturable package designs that enable Draper’s strategic product roadmap.

Specific Duties:

• Lead concept development for advanced packages (e.g., fan out wafer level, 2.5 D/3 D interposer, system in package).
• Produce detailed layout for substrates, interposers, and die to die routing using Siemens Xpedition.
• Own package-level SI/PI strategy, including high speed digital interfaces, power delivery network (PDN) design, and decoupling strategy.
• Perform SPICE, EM, and S parameter simulations to validate SI, PDN, and crosstalk.
• Partner with mechanical engineers and analysts on die attach, under fill, molding, and thermal interface materials.
• Partner with silicon, RF, and board design engineers to co-optimize die floorplans and package interfaces.
• Serve as the primary technical interface to substrate vendors, assembly houses, and OSATs.
• Author complete package build documentation, specifications, and test plans.
• Drive solutions to complex problems with limited direction – contribute to requirements development, propose paths forward, and adapt appropriately to changes in requirements.

Skills/Abilities:

• Proficiency with high density substrate and packaging layout tools. Experience with Siemens Xpedition is desirable.
• Solid understanding of high-speed design signal integrity best practices.
• Experience with SI/PI analysis using Ansys SIwave and HFSS, Hyperlynx, or other industry standard tools.

Duties/Responsibilities

Job Description:

• Translates project and system requirements into well-defined hardware architectures working with cross-functional teams.
• Innovatively solves issues, drives completion of the project to schedule, and collaboratively works with other technical contributors.
• Builds, debugs, and tests prototypes and deliverable hardware.
• Prepares documentation for manufacturing, and provides continuous support.
• Researches and enables innovative solutions for cutting-edge designs.
• Engages other engineers and partners to develop reliable, cost effective end solutions for products.
• Drives solutions to complex problems with limited direction – contributes to requirements development, proposes ways forward, and adapts appropriately to changes in requirements.
• Independently performs complex electronic architectures and designs.
• Able to manage a task with multiple cross functional members and effectively communicates status to project leadership and customers.
• Actively mentors less experienced teammates and provides thoughtful, constructive feedback.
• Support business development and proposal activities.

Skills/Abilities

• Proficiency in electronic design.
• Ability to write detailed design specifications.
• Excellent verbal and written communication skills.
• Excellent organizational skills and attention to detail.
• Excellent time management skills with the proven ability to meet deadlines.
• Strong analytical and problem-solving skills.
• Ability to prioritize tasks.Thorough understanding of engineering theories and procedures.

Education

Bachelor's degree in electrical engineering or related field. Advanced degree preferred.

Experience

5-10 years experience in electrical engineering or related field.

Additional Job Description:

Applicants selected for this position will be required to obtain and maintain a US government security clearance.

Job Location - City:

Cambridge

Job Location - State:

Massachusetts

Job Location - Postal Code:

02139-3563

The US base salary range for this full-time position is

$82,300.00 - $220,000.00

Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target salaries for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Union ranges will be in compliance with the collective bargaining agreement's approved rates by location and role. Your recruiter can share more about the specific salary range for your preferred location during the hiring process. Please note that the compensation details listed in US role postings reflect the base salary only, and does not include bonuses or benefits.

Draper supports many programs to improve work-life balance including workplace flexibility, employee clubs ranging from photography to yoga, health and finance workshops, off site social events and discounts to local museums and cultural activities.

Draper is committed to creating an inclusive environment. We understand the value of inclusivity and its impact on a high-performance culture. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, disability, age, sexual orientation, national origin, veteran status, or genetic information. Draper is committed to providing access, equal opportunity, and reasonable accommodation for individuals with disabilities in employment, its services, programs, activities. To request reasonable accommodation, please contact [e-mail].