Senior IC Packaging Design & Layout Engineer

Draper; Cambridge (MA); On-site; USD 82,300 - 220,000; Full time

Job summary

Draper seeks a skilled IC Packaging Design & Layout Engineer to lead end-to-end packaging solutions for Draper’s next-generation hardware platforms in Cambridge, MA. You will collaborate with silicon, thermal, mechanical, and manufacturing teams to deliver manufacturable, high-performance packages.

Responsibilities include creating detailed layouts, performing SI/PI analyses, and developing documentation for manufacturing.

Qualifications

• Bachelor's degree in electrical engineering or related field required.
• 5–10 years of experience in electrical engineering or related field.
• Must be able to obtain and maintain US government security clearance.

Responsibilities

• Translate project requirements into hardware architectures with cross-functional teams.
• Lead development and deliver packaging solutions meeting performance and reliability targets.
• Create end-to-end package layouts for substrates, interposers, and dies using Xpedition.

Skills

Electronic design

Signal integrity

Team collaboration

Education

Bachelor's in Electrical Engineering

Advanced degree preferred

Tools

Siemens Xpedition

Ansys SIwave

HFSS

HyperLynx

Job description

Draper seeks a skilled IC Packaging Design & Layout Engineer to lead end-to-end packaging solutions for Draper’s next-generation hardware platforms in Cambridge, MA. You will collaborate with silicon, thermal, mechanical, and manufacturing teams to deliver manufacturable, high-performance packages.

Responsibilities include creating detailed layouts, performing SI/PI analyses, and developing documentation for manufacturing.