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Lightmatter is seeking a thermo-mechanical packaging engineer to advance FEA models for wafer-level and 3D-stacked photonic packaging. You will tackle solder fatigue, warpage, and reliability to meet power and optical requirements.
You will implement multi-physics simulations with Ansys/Abaqus, develop Python/MATLAB automation, and closely partner with packaging and design teams to drive robust, scalable methodologies.
Lightmatter is seeking a thermo-mechanical packaging engineer to advance FEA models for wafer-level and 3D-stacked photonic packaging. You will tackle solder fatigue, warpage, and reliability to meet power and optical requirements.
You will implement multi-physics simulations with Ansys/Abaqus, develop Python/MATLAB automation, and closely partner with packaging and design teams to drive robust, scalable methodologies.