Lead 3D Package Assembly Engineer — Hybrid & Equity

Socket.dev; Mountain View (CA); Hybrid; USD 218,000 - 317,000; Full time

Benefits offered by this job

Health, dental & vision

Retirement matching

Life Insurance

Generous time off

Paid family leave

Disability insurance

Training & development

Commuter benefits

Hybrid workplace

Equity grants

Job summary

Lightmatter is seeking a Lead Package Assembly Integrator to drive 3D packaging development for AI data center hardware. You will lead assembly process integration, design rules, and test chip strategies with partners across foundries and OSAT to deliver high-yield, reliable packages.

You will collaborate with design teams and engineers to ensure manufacturability and performance, planning experiments and documenting methodologies while communicating findings to stakeholders.

Qualifications

• Experience in wafer scale packaging assembly process development.
• Knowledge of 2D/3D packaging technologies, materials, and equipment requirements.
• Proven ability to define requirements for test chip and assembly test vehicles.
• Understanding of photonics packaging requirements including various fiber attach methods.
• Experience with advanced packaging technologies, including thermal, mechanical, and reliability factors.

Responsibilities

• Develop end-to-end 3D package assembly, test, and fiber-attach processes for Lightmatter products, ensuring robust high yields while meeting performance and reliability goals by working closely with foundry and OSAT partners.
• Develop and execute package architectures and designs, ensuring they meet rigorous product performance standards while optimizing for manufacturability and long-term reliability.
• Define test chip requirements and manage test chip design required for 3D package process development.
• Develop and validate design rules for a high-yielding assembly process. The scope includes assembly/test, backend/RDL, silicon/package interaction, substrate, thermal/mechanical solutions, fiber attach, system integration, and other related areas.
• Plan and execute design of experiments, manage data, and perform appropriate analysis to gain insights into assembly process and design interactions.
• Perform analysis to identify key reliability risks under product use conditions and drive appropriate design and materials solutions to improve product mechanical integrity.
• Summarize and communicate to key stakeholders across Lightmatter, suppliers and customers as required.
• Write reports and document methodologies.

Skills

Wafer scale packaging

2D/3D packaging

Test chip requirements

Photonics packaging

Advanced packaging

Education

MS or PhD in Mechanical Engineering, Material Science, or related field

Job description

Lightmatter is seeking a Lead Package Assembly Integrator to drive 3D packaging development for AI data center hardware. You will lead assembly process integration, design rules, and test chip strategies with partners across foundries and OSAT to deliver high-yield, reliable packages.

You will collaborate with design teams and engineers to ensure manufacturability and performance, planning experiments and documenting methodologies while communicating findings to stakeholders.