Senior High-Speed IO Connector Design Engineer

Amphenol ICC; Yocumtown (PA); On-site; USD 110,000 - 160,000; Full time

Job summary

Amphenol Communications Solutions (ACS), a division of Amphenol Corporation, is seeking a Senior Product Development Engineer to lead the design and development of high speed IO connectors for 112Gb+ signaling. The role emphasizes ownership of a form factor, collaboration with cross-functional teams, and engagement with customers.

You'll drive signal integrity, thermal management, and manufacturability while coordinating with R&D, manufacturing, and quality groups to ensure successful NPI and

Qualifications

• 5+ years of experience in connector or high-speed product development.
• Proficiency in CAD tools (SolidWorks, Creo) and ANSYS.
• Strong understanding of signal integrity, EMI/EMC, and thermal management.
• Experience with stamping, plating, molding, and assembly.
• Ability to manage multiple projects and priorities.

Responsibilities

• Lead concept generation, design, and qualification of high speed IO connectors for 112Gb+ signaling.
• Develop connectors optimized for AI/ML workloads with signal integrity, mechanical robustness, and thermal efficiency.
• Define and execute rigorous testing protocols for electrical, mechanical, and environmental performance.
• Work with internal labs and external partners to validate performance in real-world environments.
• Manage development projects from concept through production, including timelines and deliverables.
• Serve as the primary technical interface for customer engagements and design reviews.

Skills

Excellent communication

Cross-functional collaboration

Project management

Education

Bachelor's or Master's in Mechanical or Electrical Engineering

Tools

SolidWorks

Creo

ANSYS

Job description

Amphenol Communications Solutions (ACS), a division of Amphenol Corporation, is seeking a Senior Product Development Engineer to lead the design and development of high speed IO connectors for 112Gb+ signaling. The role emphasizes ownership of a form factor, collaboration with cross-functional teams, and engagement with customers.

You'll drive signal integrity, thermal management, and manufacturability while coordinating with R&D, manufacturing, and quality groups to ensure successful NPI and