Senior Hardware Architect – SoC & PCB Packaging

Arm Limited; Chandler (AZ); On-site; USD 250,000 - 338,000; Full time

Job summary

Arm Limited is seeking an Electronics Engineer to drive PCB and silicon packaging co-design and system-level hardware architecture for advanced embedded compute platforms. You will collaborate with SoC teams, architects and platform leads to shape requirements, assess trade-offs and deliver robust hardware solutions.

The role focuses on prototyping Arm IP-based hardware platforms, working with cross-geography teams to ensure optimal performance, reliability, and cost-effectiveness in

Qualifications

• Deep technical background with SoC architectures and platforms.
• Experience with high-speed IO interfaces (PCIe Gen5/6/7, LPDDR5/6, CSI/DSI).
• Embedded board design with LSIs, FPGAs, PMICs.

Responsibilities

• Collaborate across geographies to specify, evaluate and develop PCB and silicon packaging solutions.
• Drive PCB development with chip packaging teams, routing strategies and layer optimization.
• Translate requirements into platform architectures and communicate concepts clearly.

Skills

PCB co-design

SoC packaging

System-level HW arch

High-speed IO

Power integrity

FPGA experience

Job description

Arm Limited is seeking an Electronics Engineer to drive PCB and silicon packaging co-design and system-level hardware architecture for advanced embedded compute platforms. You will collaborate with SoC teams, architects and platform leads to shape requirements, assess trade-offs and deliver robust hardware solutions.

The role focuses on prototyping Arm IP-based hardware platforms, working with cross-geography teams to ensure optimal performance, reliability, and cost-effectiveness in