Senior FCBGA Package Lead — NPI & Manufacturing

Astera Labs

San Jose (CA)

On-site

USD 160,000 - 200,000

Full time

14 days+

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Benefits offered by this job

Discretionary bonus

Incentives and benefits

Job summary

Astera Labs in San Jose, CA seeks a Lead Package Engineer to drive development, qualification, and manufacturing of advanced FCBGA packages from concept through NPI to high-volume production. You will own technical execution, supplier management, and cross-functional program leadership.

The role partners with design, product engineering, quality, and OSAT suppliers to deliver robust, reliable package solutions, lead reliability planning, investigate field issues, and advance CPO/NPO initiatives.

Qualifications

5+ years of professional experience in electronic packaging.
Experience with FCBGA assembly and laminate substrates.
NPI development experience for advanced flip-chip packages.
Ability to manage substrate suppliers and OSAT partners.
Strong cross-functional leadership across engineering and quality teams.

Responsibilities

Lead FCBGA NPI from concept to production release.
Provide technical leadership in assembly manufacturing and laminate substrates.
Manage schedule, quality, and risk with suppliers and OSAT partners.
Drive project management: milestones, risk mitigation, issue resolution.
Collaborate across design, product engineering, QA, marketing, and suppliers.
Lead reliability planning and customer-quality issue resolution.
Root cause analysis and corrective actions with teams and suppliers.
Support warpage characterization and packaging technology developments (CPO/NPO).