Technical Lead, Advanced FCBGA Packaging & NPI

Astera Labs; San Jose, Northern (CA, KY); Hybrid; USD 160,000 - 200,000; Full time

Job summary

Astera Labs in San Jose, CA is seeking a Technical Lead Package Platform Engineer to drive development, qualification, and manufacturing of FCBGA packages.

The role requires owning technical execution, supplier management with substrate suppliers and OSAT partners, and leading cross-functional teams across Product Engineering, Quality, and Marketing to deliver robust, reliable packaging solutions.

Qualifications

• Experience in FCBGA assembly and laminate substrate technologies.
• NPI development for advanced flip-chip packages from concept to production.
• Die netlist to package design and manufacturing experience.
• Experience managing substrate suppliers and OSAT partners.
• Strong technical project management across cross-functional teams.
• Ability to lead across Product Engineering, Program Management, Quality, Marketing, and design.
• Experience handling customer returns and field quality issues in packaging.
• Root cause analysis and corrective actions expertise.

Responsibilities

• Lead FCBGA NPI development from concept through production release.
• Provide technical leadership in FCBGA assembly manufacturing and laminate substrates.
• Manage schedule, quality, and manufacturing readiness with suppliers and OSAT.
• Lead project management: milestones, risk, issue escalation, cross-functional execution.
• Collaborate with internal teams to ensure successful product development and launch.
• Lead package reliability assessment and qualification planning for FCBGA.
• Support system-level reliability assessment for large-size FCBGA packages.
• Investigate and resolve customer returns and field quality issues related to packaging.
• Drive root cause analysis, containment, corrective actions, and recurrence prevention.
• Support warpage characterization and improvement, including materials and assembly processes.
• Contribute expertise to CPO and NPO packaging technologies.

Skills

FCBGA assembly

NPI development

Project management

Cross-functional leadership

Root cause analysis

Tools

Cadence Allegro Package Designer (APD)

Job description

Astera Labs in San Jose, CA is seeking a Technical Lead Package Platform Engineer to drive development, qualification, and manufacturing of FCBGA packages.

The role requires owning technical execution, supplier management with substrate suppliers and OSAT partners, and leading cross-functional teams across Product Engineering, Quality, and Marketing to deliver robust, reliable packaging solutions.