Senior Electro-Mechanical Packaging Engineer

Lockheed Martin

Orlando (FL)

On-site

USD 129,000 - 240,000

Full time

32 hours ago
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Benefits offered by this job

Medical coverage
Dental
Vision
Flexible schedules (4x10)
401(k) match
Paid time off
Parental Leave
Education assistance
Life Insurance
Short‑Term Disability
Long‑Term Disability

Job summary

Lockheed Martin in Orlando is seeking an Electro‑Mechanical Design Engineer for the Advanced Electronics Packaging team. You will design, prototype, and test cutting‑edge packaging solutions, collaborating with electrical, systems, test, and product design engineers.

You will mentor junior engineers and contribute to risk assessments while staying current with emerging semiconductor packaging technologies. Orlando location with a strong focus on flight‑qualified hardware.

Qualifications

  • BS in EE/ME or related STEM field from an accredited university.
  • Minimum 10 years of professional experience in electromechanical engineering with a relevant degree.
  • Alternatively, 15+ years of electromechanical experience without a degree.

Responsibilities

  • Conceive and model 2D/3D heterogeneous package architectures.
  • Develop mechanical/electrical designs for thin-film interconnects and thermal features.
  • Create test plans and validate electrical, thermal, and mechanical performance.
  • Document designs with drawings, BOMs, specs, and verification reports.

Skills

Microelectronics & Layout Design
Interconnect Engineering
High-Speed Systems
Requirements Management
Component Selection

Education

BS in Electrical/Mechanical Eng or related STEM

Tools

MBSE
CAMEO

Job description

Lockheed Martin in Orlando is seeking an Electro‑Mechanical Design Engineer for the Advanced Electronics Packaging team. You will design, prototype, and test cutting‑edge packaging solutions, collaborating with electrical, systems, test, and product design engineers.

You will mentor junior engineers and contribute to risk assessments while staying current with emerging semiconductor packaging technologies. Orlando location with a strong focus on flight‑qualified hardware.

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