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Lockheed Martin in Orlando is seeking an Electro‑Mechanical Design Engineer for the Advanced Electronics Packaging team. You will design, prototype, and test cutting‑edge packaging solutions, collaborating with electrical, systems, test, and product design engineers.
You will mentor junior engineers and contribute to risk assessments while staying current with emerging semiconductor packaging technologies. Orlando location with a strong focus on flight‑qualified hardware.
Lockheed Martin in Orlando is seeking an Electro‑Mechanical Design Engineer for the Advanced Electronics Packaging team. You will design, prototype, and test cutting‑edge packaging solutions, collaborating with electrical, systems, test, and product design engineers.
You will mentor junior engineers and contribute to risk assessments while staying current with emerging semiconductor packaging technologies. Orlando location with a strong focus on flight‑qualified hardware.