Senior Defect Metrology & Yield Engineer - Packaging

SkyWater Technology; Kissimmee (FL); On-site; USD 114,000 - 171,000; Full time

Job summary

SkyWater Technology, based in the United States with a Florida Advanced Packaging site, seeks a Defect Metrology Process Engineer to lead and improve AOI and metrology for HI and advanced packaging technologies.

You will integrate metrology with MES, manage data archiving, review defects, and collaborate across process and tool teams to drive yield and device performance, with US citizenship required.

Qualifications

• 8+ years of defect inspection/metrology in semiconductor manufacturing.
• Experience with defect feedback to process owners.
• Metrology systems integration with MES and automation.
• Knowledge of DOE, SPC and Six Sigma concepts.
• US Citizenship required for security clearance.

Responsibilities

• Coordinate integration of metrology systems into site MES and automation.
• Implement and maintain metrology support systems and data archiving.
• Support multiple fab areas with thickness/defect measurements, pillar height/location, AFM and profilometry.
• Review defects and SPC data daily to drive yield improvements.
• Coordinate with engineering to report die pad locations via automation in FOWLP.
• Investigate and drive integration changes for improved device performance and yield.
• Collaborate with process and tool engineers to identify marginalities and improvements.
• Perform other duties as assigned.

Skills

Defect inspection

Defect management systems

MES configuration

AOI metrology

Metrology methods

Layout data prep

MEMS/CMOS metrology

DOE/SPC/6-sigma

Project management

U.S. Citizenship

Education

BS in Electrical Engineering

MS in Electrical Engineering

PhD in Electrical Engineering

Tools

Klarity

Odyssey

Discover

INGRES

OpCenter

Workstream

PROMIS

Job description

SkyWater Technology, based in the United States with a Florida Advanced Packaging site, seeks a Defect Metrology Process Engineer to lead and improve AOI and metrology for HI and advanced packaging technologies.

You will integrate metrology with MES, manage data archiving, review defects, and collaborate across process and tool teams to drive yield and device performance, with US citizenship required.