Senior MEMS & Photonic Packaging Process Engineer

SkyWater Technology, Inc.; Kissimmee (FL); On-site; USD 159,000 - 238,000; Full time

Benefits offered by this job

401k match

Life insurance

Medical coverage

Vision

Dental

Paid time off

On-site gym

On-site market

Job summary

SkyWater Technology, Inc. is seeking an experienced Process Integration Engineer for our Florida Advanced Packaging site. You will lead and improve an integrated process flow, collaborating with customers and cross-functional teams to deliver manufacturable recipes for MEMS/photonic devices.

Requirements include 10+ years in advanced packaging, strong DOE/SPC/6-Sigma knowledge, and US Citizenship to support security clearances. Competitive salary and comprehensive benefits are provided.

Qualifications

• 10+ years in Advanced Packaging Fab environments.
• MEMS/Photonic device integration knowledge.
• Knowledge of DOE, SPC, and 6-sigma concepts and applications.
• Project Management skills or training are a plus and security clearance for US citizenship.

Responsibilities

• Develop, transfer, and integrate new processes in a manufacturing environment.
• Create robust, manufacturable process recipes for foundry customers in metal/dielectric deposition, photo, etch, or CMP areas.
• Lead MEMS/Photonic device integration for advanced packaging backend.
• Utilize metrology to characterize process conditions and document results.
• Identify processing marginalities and drive improvements with cross-functional teams.
• Monitor in-line and end-of-line SPC charts for trends and potential actions.
• Observe and improve electrical test parametrics; may evolve into project management.

Skills

Process Development

Process Integration

DOE/concepts

SPC

Six Sigma

Project Management

Problem Solving

Education

BS Engineering

MS/PhD preferred

Job description

SkyWater Technology, Inc. is seeking an experienced Process Integration Engineer for our Florida Advanced Packaging site. You will lead and improve an integrated process flow, collaborating with customers and cross-functional teams to deliver manufacturable recipes for MEMS/photonic devices.

Requirements include 10+ years in advanced packaging, strong DOE/SPC/6-Sigma knowledge, and US Citizenship to support security clearances. Competitive salary and comprehensive benefits are provided.