Senior Back-End Process Engineer - Sealing & Packaging

Analog Devices, Inc.; Chelmsford, Elizabeth (MA, NJ); On-site; USD 96,000 - 131,000; Full time

Benefits offered by this job

Discretionary bonus

Medical insurance (vision & dental)

401k matching

Paid vacation & holidays

Job summary

Analog Devices, Inc. is seeking a Development Process Engineer to advance back-end assembly processes, including seam sealing and packaging operations for microwave/millimeter-wave electronics.

The role emphasizes process development, tooling qualification, and cross-functional collaboration across design, quality, and operations. The candidate should hold a BS/MS in a technical field with 5+ years in electronics assembly, SPC/DOE proficiency, and experience in cleanroom environments.

Qualifications

• BS/MS in Electrical/Mechanical/Chemical Engineering, Physics, Materials Science, or related technical discipline.
• Strong analytical mindset and problem-solving skills.
• Experience with SPC and DOE methodologies.
• Experience in electronics assembly and manufacturing including laser/resistance seam sealing, reflow sealing, leak test, lead forming, and surface mount tech.

Responsibilities

• Develop, sustain, and optimize seam sealing and back-end assembly processes, focusing on laser/resistance seam sealing, reflow sealing, leak test, and packaging operations.
• Standardize manufacturing processes in MES and related systems.
• Troubleshoot process and equipment issues and implement robust corrective actions.
• Collaborate across Design, Quality, Operations, and Planning to ensure manufacturing readiness and issue resolution.
• Lead or contribute to continuous improvement initiatives to improve throughput, yield, and robustness.
• Qualify new production tools, including documentation and operator training.

Skills

Analytical thinking

Problem solving

SPC

DOE

Education

BS/MS in Electrical/Mechanical/Chemical Engineering, Physics, Materials Science

Tools

Vision recognition systems

MES systems

Job description

Analog Devices, Inc. is seeking a Development Process Engineer to advance back-end assembly processes, including seam sealing and packaging operations for microwave/millimeter-wave electronics.

The role emphasizes process development, tooling qualification, and cross-functional collaboration across design, quality, and operations. The candidate should hold a BS/MS in a technical field with 5+ years in electronics assembly, SPC/DOE proficiency, and experience in cleanroom environments.