Director, Product Applications

Confidential; Missouri; On-site; USD 180,000 - 260,000; Full time

Benefits offered by this job

Relocation package

Job summary

Confidential is seeking a Director, Product Applications to lead a global Product Applications organization, shaping how products move from technical development into customer qualification and commercialization.

This is not a traditional Applications Engineering management role, offering the chance to build and guide a high-performing team across R&D, customers, PM, Quality, Operations, and Commercial teams.

Qualifications

• 12+ years in semiconductor materials, process engineering, applications engineering or advanced packaging.

Responsibilities

• Own product characterization and application readiness

Skills

Semiconductor materials

Process engineering

Applications engineering

Advanced packaging

Technical leadership

Job description

I’m partnering with a leading semiconductor materials organization on a Director, Product Applications search, and we’re looking for someone who wants to have a real impact on how products move from technical development into customer qualification and commercialization.

This is not a traditional Applications Engineering management role. You’ll have the opportunity to lead and shape a global Product Applications organization while working closely with R&D, strategic customers, Product Management, Quality, Operations and Commercial teams.

What makes the role interesting?

You’ll have ownership across:

• Product characterization and application readiness
• Customer qualification and technical engagement
• Process recommendations, application windows and technical data packages
• Product commercialization and NPI
• Technical strategy and customer-facing support
• Building and developing a high-performing technical team
• Translating customer needs into product and commercialization priorities

The ideal background includes 12+ years in semiconductor materials, process engineering, applications engineering or advanced packaging, along with significant technical leadership experience.

Experience with lithography materials, semiconductor/packaging materials, temporary bonding/debonding, process chemicals or advanced packaging would be especially relevant.

Relocation: Very comprehensive relocation package offered

Candidates must be currently authorized to work in the U.S. without the need for employer sponsorship now or in the future.