Senior AI Hardware ESI Engineer for Hyperscale Data Centers

ZT Group Intl, Inc. dba ZT Systems; Secaucus (NJ); On-site; USD 116,000 - 194,000; Full time

Benefits offered by this job

Competitive base salary

Bonus eligibility

401(k) retirement savings plan

Tuition reimbursement

Job summary

ZT Systems, a Sanmina Company, seeks a Principal Early Supplier Involvement (ESI) Engineer to drive hardware co-design and manufacturability for our next-generation Data Center AI Infrastructure platform. You will bridge System Architects and mechanical/thermal/electrical teams with strategic suppliers to de-risk high-density thermal architectures, high-speed PCBA, and ultra-high-power delivery systems.

The ideal candidate has 4–8+ years in NPI, hands-on GD&T, and CAD tools, with Tier‑1 EMS

Qualifications

• 4–8+ years in NPI engineering or hardware design for high-density compute hardware.
• Hands-on GD&T, CAD tools, and DFM reviews with EMS and PCB fabricators.
• Ability to translate AI system requirements into supplier specifications.

Responsibilities

• AI Hardware Co-Design & Technical Integration with thermal and liquid cooling.
• DFM/DFT reviews for high-density AI accelerator boards and interconnects.
• Collaborate on ultra-high-density PDUs and VRMs for 100kW+ racks.
• Work with chassis and rack suppliers on structural integration and tolerances.
• Oversee prototyping, EVT/DVT cycles, and ramp risk mitigation.
• Identify single points of failure and drive second-source strategies.
• Build should-cost models and optimize material/process yield.

Skills

Hardware co-design

Thermal management

DFM/DFT reviews

GD&T

CAD software

High-speed PCBA

Power delivery

Supplier engagement

Negotiation

Cross-functional collaboration

Education

Bachelor’s or Master’s degree in Mechanical, Electrical, Materials Science, or Manufacturing Engineering

Tools

Creo

SolidWorks

Siemens NX

Job description

ZT Systems, a Sanmina Company, seeks a Principal Early Supplier Involvement (ESI) Engineer to drive hardware co-design and manufacturability for our next-generation Data Center AI Infrastructure platform. You will bridge System Architects and mechanical/thermal/electrical teams with strategic suppliers to de-risk high-density thermal architectures, high-speed PCBA, and ultra-high-power delivery systems.

The ideal candidate has 4–8+ years in NPI, hands-on GD&T, and CAD tools, with Tier‑1 EMS