Senior Advanced Packaging & Integration Leader

Applied Materials, Inc.; Santa Clara (CA); On-site; USD 200,000 - 275,000; Full time

Benefits offered by this job

Stock award program

Comprehensive benefits package

Job summary

Applied Materials, Inc. is seeking an Advanced Packaging Technology & Integration Leader to drive next-generation semiconductor packaging and 3D integration technologies.

You will lead cross-functional teams across materials, unit-process development, integration, device/package architecture, and manufacturing, translating physics and materials insights into manufacturable solutions. Strong leadership and collaboration with customers and partners are essential.

Qualifications

• Advanced degree in a closely related discipline preferred, or equivalent technology-development expertise.
• Demonstrated experience developing semiconductor technologies from concept to validation.
• Deep understanding of semiconductor process integration.
• Ability to lead complex, multidisciplinary technology-development programs.

Responsibilities

• Develop differentiated semiconductor packaging technologies from first principles.
• Provide technical leadership across bonding, TSV, interposers, chiplets, and thermal management.
• Define and drive complete process-integration strategies across deposition, etch, CMP, cleaning, and packaging.
• Lead multidisciplinary teams and mentor senior technical staff.
• Engage with customers and industry partners to translate requirements into programs.

Skills

Hybrid bonding

TSV technology

2.5D/3D integration

Interposers

Bridge die

Chiplet integration

Thermal-management materials

Thin-wafer processing

Wafer/die bonding

Advanced metallization

CMP and surface preparation

Mechanical stress

Wafer warpage

Semiconductor/package reliability

Education

Advanced degree in Materials Science, Chemical Eng., E.E., Mechanical Eng., Applied Physics, or related

Job description

Applied Materials, Inc. is seeking an Advanced Packaging Technology & Integration Leader to drive next-generation semiconductor packaging and 3D integration technologies.

You will lead cross-functional teams across materials, unit-process development, integration, device/package architecture, and manufacturing, translating physics and materials insights into manufacturable solutions. Strong leadership and collaboration with customers and partners are essential.