Principal Package Design Engineer

Renesas Electronics; California (MO); On-site; USD 100,000 - 140,000; Full time

Benefits offered by this job

Short-Term Incentive program

Long-Term Incentive equity grant

Job summary

Renesas Electronics is seeking a Senior Advanced Packaging Engineer in California to lead the development and integration of innovative packaging solutions for high-performance electronics. You will be responsible for designing and qualifying next-generation semiconductor packaging while collaborating with various engineering teams.

The ideal candidate should hold an MSc or PhD in a relevant field and have over 5 years of experience in semiconductor packaging. The role offers exciting short-term and long-term incentive opportunities based on performance.

Qualifications

• 5+ years of experience in semiconductor packaging or advanced electronics packaging.
• Strong knowledge of advanced packaging technologies, materials, and assembly processes.
• Experience with package reliability testing and qualification standards.

Responsibilities

• Lead the design and qualification of semiconductor packaging solutions.
• Define package architecture based on reliability and cost requirements.
• Collaborate with design and manufacturing teams to ensure package performance.

Skills

Deep expertise in semiconductor packaging technologies

Strong project leadership

Thermal and mechanical reliability knowledge

Cross-functional communication

Troubleshooting packaging failures

Education

MSc or PhD degree in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or related field

Tools

Cadence Allegro Package Designer

Solid Works

ANSYS

COMSOL

JMP / Minitab

Job description

Senior Advanced Packaging Engineer

We are seeking a Senior Advanced Packaging Engineer to lead the development and integration of next-generation packaging solutions for high-performance semiconductors and electronic products. This role will focus on advanced package architectures, assembly processes, thermal and mechanical reliability, and cross-functional collaboration with design, manufacturing, suppliers, and quality teams. The ideal candidate has deep expertise in semiconductor packaging technologies and a strong track record of bringing complex products from concept through qualification and high-volume production.

Responsibilities

• Lead the design, development, and qualification of advanced semiconductor packaging solutions, including:
  • Flip-chip, Chip Embedding
  • Wafer-level packaging (WLP/FOWLP)
  • Panel-level packaging (laminate, molding)
  • 2.5D/3D packaging
  • System-in-package (SiP)
  • Ball grid array (BGA/CSP)
• Define package architecture based on electrical, thermal, mechanical, reliability, and cost requirements.
• Drive package technology selection and development for new product introductions.
• Work closely with IC design, substrate, board, thermal, reliability, and manufacturing teams to ensure package compatibility and performance.
• Oversee package layout reviews, stack-up definition, material selection, and interconnect strategy.
• Perform and guide simulations and analysis related to:
  • Signal integrity / power integrity
  • Thermal performance
  • Mechanical stress / warpage
  • Design for manufacturability (DFM)
• Develop assembly flows and process requirements for OSATs and manufacturing partners.
• Lead package qualification activities, including DOE planning, failure analysis, and reliability testing.
• Resolve packaging-related issues during NPI prototype builds, qualification, and production ramp.
• Collaborate with suppliers and internal/external manufacturing partners on process improvements, material evaluation, and yield optimization.
• Create and maintain package specifications, design rules, process documentation, and technical reports.
• Mentor junior engineers and provide technical leadership across packaging initiatives.

Required

• MSc or PhD degree in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or related field.
• 5+ years of experience in semiconductor packaging or advanced electronics packaging.
• Strong knowledge of advanced packaging technologies, materials, and assembly processes.
• Experience with package reliability testing and qualification standards.
• Deep understanding of thermal, mechanical, and electrical interactions in package design.
• Experience working with OSATs, substrate vendors, assembly houses, and semiconductor supply chains.
• Ability to troubleshoot packaging failures and drive root cause/corrective action.
• Strong project leadership and cross-functional communication skills.

Preferred

• Master’s or PhD in a relevant engineering discipline.
• Experience with power semiconductor devices and packaging including Si/SiC/GaN MOSFETS, Power Modules, Intelligent Power modules and their applications in consumer and industrial, automotive, performance computing.computing, AI/ML hardware or mobile products.
• Hands‑on experience with tools for package design and simulation such as:
  • Cadence Allegro Package Designer
  • Solid Works
  • ANSYS
  • COMSOL
  • JMP / Minitab
• Knowledge of JEDEC standards, IPC standards, and semiconductor qualification methods.
• Experience in W2W, D2W, D2D 3D heterogeneous integration and chiplet-based packaging.

Base Salary Range

The base salary range listed represents the good faith estimate of the hourly wage or salary range that the company reasonably expects to pay for this position at the time of hire. Actual compensation decisions are based on a variety of factors, including but not limited to geographic location, relevant experience, skillset, and internal equity.

Additional Rewards

• Short-Term Incentive (STI): This position is eligible to participate in the company's annual short-term incentive/bonus program, subject to company performance and individual achievements.
• Long-Term Incentive (LTI): This role is eligible for a new-hire equity grant under the company's long-term incentive guidelines, subject to board approval and standard vesting schedules.

Equal Opportunity Employment Statement

Renesas Electronics is an equal opportunity and affirmative action employer, committed to celebrating diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by federal, state or local law. For more information, please read our Diversity & Inclusion Statement. Renesas Electronics deals with dual-use technology that is subject to U.S. export controls regulations. Under these regulations it may be necessary for Renesas to obtain U.S. government export license prior to release of technology to certain persons. The decision whether or not to file or pursue an export license application is at the sole discretion of Renesas.