Senior Advanced Packaging & PDN Architect (2.5D/3D)

Axelera AI; Germany (OH); Hybrid; USD 81,272 - 104,493; Full time

Benefits offered by this job

Competitive compensation package

Pension plan

Extensive employee insurances

Option to acquire company shares

Job summary

Axelera AI seeks a Senior Advanced Packaging & Power Delivery Engineer to shape silicon architecture for next-generation AI accelerators. This role involves end-to-end power delivery design and collaboration with engineering teams.

Candidates should possess a strong background in power delivery and advanced packaging, with a focus on 2.5D/3D IC technologies. The position offers attractive benefits and promotes a culture of creativity and innovation, along with desirable locations in Europe, particularly Belgium and Italy.

Qualifications

• 7+ years of experience in power delivery or advanced packaging design.
• Demonstrated expertise in on-die power grid design and PCB PDN analysis.
• Hands-on experience with 2.5D and/or 3D IC packaging technologies.

Responsibilities

• Own power-delivery design end to end.
• Lead advanced packaging architecture decisions.
• Perform SI/PI verification and sign-off across the full stack.

Skills

Power delivery design

Advanced packaging technologies

Cross-functional collaboration

Signal integrity analysis

Education

Bachelor’s or Master’s degree in Electrical Engineering

PhD

Tools

EDA tools for power integrity

Job description

Axelera AI seeks a Senior Advanced Packaging & Power Delivery Engineer to shape silicon architecture for next-generation AI accelerators. This role involves end-to-end power delivery design and collaboration with engineering teams.

Candidates should possess a strong background in power delivery and advanced packaging, with a focus on 2.5D/3D IC technologies. The position offers attractive benefits and promotes a culture of creativity and innovation, along with desirable locations in Europe, particularly Belgium and Italy.