Senior Advanced Packaging Diagnostics Engineer

SkyWater Technology, Inc.

Kissimmee (FL)

On-site

USD 140,000 - 210,000

Full time

3 days ago

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Job summary

SkyWater Technology, Inc. in Florida is seeking an Advanced Packaging Development and Research Engineer with extensive experience in wafer finishing, wafer-level assembly, and quantum device packaging.

You will design and troubleshoot complex processes, develop test systems, and collaborate with foundries and internal clients to deliver qualified products. Ideal candidate has 12+ years in Advanced Packaging, strong DOE/SPC/6-Sigma knowledge, and a track record in FanOut, Si Interposer, and

Qualifications

BS in Engineering; MS/PhD preferred for advanced roles.
12+ years in Process Development & Integration for Advanced Packaging Fab environments.
Experience with FanOut, Si Interposer, Hybrid Bonding and related packaging.
DOE, SPC, and 6-sigma concepts and applications.
Strong problem-solving, data-driven, and cross-functional collaboration.

Responsibilities

Support prototype build schedules and wafer deliverables for Si interposer, FanOut, and hybrid bonding processes.
Identify features and packages requiring development and ensure on-schedule, high-yield delivery.
Lead external partnerships to enable fast turn prototyping and root-cause analysis.
Coordinate failure analysis and interpret results across internal and external labs.
Review, interpret and direct FEA needs for packaging projects.
Create training documents and write technical papers to disseminate knowledge.
Understand process integration for MEMS/Photonics/HPC/AI/Quantum devices and related teams.
Use data analysis tools to drive data-driven decisions and continuous improvement.